206 Ty J. Prosa and David J. Larson
device structures with a complex thermal diffusivity, encap- sulating finished specimens may improve the mass resolving power of peaks in the mass spectrum, as well as increase the analyzed field of view and is worth further investigation.
SUMMARY
Modern APT has seen tremendous growth during the past decade. Much of this growth has been enabled by advances in FIB-based specimen preparation methodology, as discussed in this review, both in terms of practices and procedures as well as advances in available hardware—instrumentation, manipulation, and specimen holders. The key steps for enabling correlative analysis with tEBSD, TEM, and APT have been discussed. Strategies for preparing specimens for modern microelectronic device structures have been dis- cussed in detail. Even more complex topologies, like those presented by NWs and NPs, have been successfully prepared and analyzed, as shown here. Who knows what the future holds, but developments in new specimen preparation hardware, like cryo-FIB lift-out and the necessary supporting hardware, promise to open a whole new period of specimen preparation development. We eagerly look forward to these developments in the decades to come.
ACKNOWLEDGMENTS
The authors thank all the members of the CAMECA application’s team who contributed to these results, aswell as fruitful discussion, and also acknowledge the many interac- tions with customers and colleagues. Thank you to G. D. W. Smith for providing a perspective on the origins of using the FIB to prepare atom probe tomography specimens.
REFERENCES
AGRAWAL, R., BERNAL, R.A., ISHEIM,D.&ESPINOSA, H.D. (2011). Characterizing atomic composition and dopant distribution in wide band gap semiconductor nanowires using laser-assisted atom probe tomography. J Phys Chem C 115, 17688–17694.
ALEXANDER, K.B., ANGELINI,P. & MILLER, M.K. (1989). Precision ion milling of field-ion specimens. JPhys(Paris), Colloq 50, 549–554.
ARSLAN,I.,MARQUIS,E.A.,HOMER,M.,HEKMATY,M.A.&BARTELT,N.C. (2008). Towards better 3-D reconstructions by combining electron tomography and atom-probe tomography. Ultramicroscopy 108, 1579–1585.
BABINSKY, K., DE KLOE, R., CLEMENS,H.&PRIMIG, S. (2014). A novel approach for site-specific atom probe specimen preparation by focused ion beam and transmission electron backscatter diffraction. Ultramicroscopy 144,9–18.
BABINSKY, K., KNABL, W., LORICH, A., DE KLOE, R., CLEMENS,H.& PRIMIG, S. (2015). Grain boundary study of technically pure molybdenum by combining APT and TKD. Ultramicroscopy 159, (Pt 2), 445–451.
BIRDSEYE, P.J., SMITH, D.A. & SMITH, G.D.W. (1974). Analogue investigations of electric field distribution and ion trajectories in the field ion microscope. J Phys D 7, 1642–1651.
BLUMTRITT, H., ISHEIM, D., SENZ, S., SEIDMAN, D.N. & MOUTANABBIR, O. (2014). Preparation of nanowire specimens for laser-assisted atom probe tomography. Nanotechnology 25, 435704.
BRAN, J., JEAN, M., LARDÉ, R., SAUVAGE, X., BRETON, J.-M.L. & PAUTRAT, A. (2013). Elaboration and characterization of Cu/Co multilayered nanowires. J Korean Phys Soc 62, 1744–1747.
CHEN, Y., RICE, K.P., PROSA, T.J.,MARQUIS, E.A. & REED, R.C. (2015). Integrated APT/t-EBSD for grain boundary analysis of thermally grown oxide on a Ni-based superalloy. Microsc Microanal 21, 687–688.
CHEN, Y., RICE, K.R. & PROSA, T.J. (2016). Site-specific sample preparation using correlative microscopy: APT and tEBSD. Microsc Anal Suppl May/June (S4).
COJOCARU-MIRÉDIN, O., PYUCK-PA, C., ABOU-RAS, D., SCHMIDT, S.S., CABALLERO,R.&RAABE, D. (2011). Characterization of grain boundaries in Cu(In,Ga)Se films using atom-probe tomography. IEEE J Photovolt 1, 207–212.
DIERCKS, D.R., GORMAN, B.P. & MULDERS, J.J.L. (in submission). Electron beam induced deposition for atom probe tomography specimen capping layers. Microsc Microanal. doi:10.1017/ S1431927616011740.
DIERCKS,D.R., TONG,J., ZHU,H.,KEE,R., BAURE,G.,NINO, J.C.,O’HAYRE, R. & GORMAN, B.P. (2016). Three-dimensional quantification of composition and electrostatic potential at individual grain boundaries in doped ceria. JMater Chem A 4,5167–5175.
EATON, H.C. & BAYUZICK, R.J. (1978). Field-induced stresses in field emitters. Surf Sci 70, 408–426.
EICHFELD, C.M., GERSTL, S.S.A., PROSA, T., KE, Y., REDWING, J.M. & MOHNEY, S.E. (2012). Local electrode atom probe analysis of silicon nanowires grown with an aluminum catalyst. Nanotechnology 23, 215205.
EL KOUSSEIFI, M., PANCIERA, F., HOUMMADA, K., DESCOINS, M., BARON,T. & MANGELINCK, D. (2014). Ni silicide nanowires analysis by atom probe tomography. Microelectron Eng 120,47–51.
ESTIVILL, R., AUDOIT, G., BARNES, J.-P., GRENIER,A.&BLAVETTE,D. (2016). Preparation and analysis of atom probe tips by xenon focused ion beam milling. Microsc Microanal 22, 576–582.
FELFER,P., ALAM,T., RINGER,S.P.&CAIRNEY, J.M. (2012). A reproducible method for damage-free site-specificpreparation of atom probe tips from interfaces. Microsc Res Tech 75, 484–491.
FELFER,P., BENNDORF,P.,MASTERS,A.,MASCHMEYER,T.&CAIRNEY,J.M. (2014). Revealing the distribution of the atoms within individual bimetallic catalyst nanoparticles. Angew Chem Int Ed Engl 53, 11190–11193.
FELFER,P.&CAIRNEY, J. (2011a). New equipment for correlative FIB/ TEM/atom probe and site-specific preparation using STEM live imaging. Microsc Microanal 17(S2), 756–757.
FELFER, P., LI, T., EDER, K., GALINSKI, H., MAGYAR, A.P., BELL, D.C., SMITH, G.D.W., KRUSE, N., RINGER, S.P. & CAIRNEY, J.M. (2015). New approaches to nanoparticle sample fabrication for atom probe tomography. Ultramicroscopy 159(Pt 2), 413–419.
FELFER, P., RINGER, S.P. & CAIRNEY, J.M. (2011b). Shaping the lens of the atom probe: Fabrication of site specific, oriented specimens and application to grain boundary analysis. Ultramicroscopy 111, 435–439.
FOLCKE, E., LARDE, R., LE BRETON, J.M., GRUBER, M., VURPILLOT, F., SHIELD, J.E., RUI,X. & PATTERSON, M.M. (2012). Laser-assisted atom probe tomography investigation of magnetic FePt nanoclusters: First experiments. J Alloy Compd 517,40–44.
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