EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION SEM SUPPLIES Colloidal Compounds & Conductive Adhesives (continued)


 EPO-TEK – Epoxy Conductive Adhesive (continued)  EPO-TEK®


H20S


Epo-Tek® Tek®


H20S is a modified version of Epo- H20E. Epo-Tek® H20S is a highly reliable, two


component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® simple to use. Epo-Tek®


H20S is extremely H20S pot life is 2.5 days


and shelf life is one year when store at room temperature.


Maximum Bond Line Cure Schedules:


175°C ..........................................45 seconds 150°C ............................................5 minutes 120°C ..........................................15 minutes 100°C ..........................................45 minutes 80°C ............................................90 minutes


Typical Properties (to be used as a guide only, not a specification)


Physical Properties: Color:


Consistency:


Viscosity (@ 100 RPM / 23˚C): Thixotropic Index:


Glass Transition Temp (Tg):


Coefficient of Thermal Expansion (CTE):


Shore D Hardness:


Lap Shear Strength @ 23˚C: Die Shear Strength @ 23˚C: Weight Loss:


Degradation Temp (TGA): Operating Temp:


Storage Modulus @ 23˚C: Ion:


Particle Size:


Electrical Properties: Volume Resistivity @ 23˚C:


Thermal Properties Thermal Conductivity:


RT 12672-20S Epo-Tek®


Part A – silver; Part B – silver Smooth, thixotropic – 4000 cPs 1,800 – 2,800 cPs 5


≥ 80˚C (Dynamic cure 20 – 200˚C / ISO 25 Min; Ramp -10 – 200˚C @20˚C/Min)


Below Tg: 31 x 10-6 Above Tg: 120 x 10-6


57 1,240 psi ≥ 5 kg / 1,700 psi


@200˚C: 0.40%; @250˚C: 0.60%; @300˚C: 1.37%


414˚C


Continuous: -55˚C to 200˚C Intermittent: -55˚C to 300˚C


339, 720 psi Cl-


NH4+


162 ppm; Na+ 282 ppm


≤ 20 microns ≤ 0.0005 Ohm-cm 3.25 W/mK H20S Adhesive 1 oz 0 ppm in/in/˚C in/in/˚C


 EPO-TEK® Epo-Tek®


H22


H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.


 Smooth, free-flowing, slightly thixotropic paste


 High Tg allows it to be used for high temperature applications ≤300°C)


 Contains no solvents – It is a NASA approved low outgassing epoxy.  Excellent resistance to solvents, chemicals and moisture  Extended pot life and fast curing at low temperature <100°C


 Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding.


Maximum Bond Line Cure Schedules:


150°C................................................................................5 minutes 120°C..............................................................................10 minutes 100°C..............................................................................20 minutes 80°C................................................................................45 minutes


Typical Properties (to be used as a guide only, not a specification)


Physical Properties: Color:


Consistency:


Viscosity (@ 100 RPM / 23˚C): Thixotropic Index:


Glass Transition Temp (Tg):


Coefficient of Thermal Expansion (CTE):


Shore D Hardness:


Lap Shear Strength @ 23˚C: Die Shear Strength @ 23˚C: Weight Loss:


Degradation Temp (TGA): Operating Temp:


Storage Modulus @ 23˚C: Ion:


Particle Size:


Electrical Properties: Volume Resistivity @ 23˚C:


Thermal Properties Thermal Conductivity:


RT 12673-22 Epo-Tek®


Part A – silver; Part B – amber Smooth, flowing paste 12,000 – 20,000 cPs 2.36


≥ 100˚C (Dynamic cure 20 – 200˚C / ISO 25 Min; Ramp -10 – 200˚C @20˚C/Min)


Below Tg: 39 x 10-6 Above Tg: 224 x 10-6


80 1,980 psi ≥ 5 kg / 1,700 psi


@200˚C: 0.09%; @250˚C: 0.23%; @300˚C: 1.42%


454˚C


Continuous: -55˚C to 250˚C Intermittent: -55˚C to 350˚C


540, 120 psi


Cl- 175 ppm; Na+ NH4+


≤ 45 microns ≤ 0.005 Ohm-cm .94 W/mK H22 Adhesive 1 oz 148 ppm; K+


60 ppm 6 ppm


in/in/˚C in/in/˚C


63


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