EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION SEM SUPPLIES
Colloidal Compounds & Conductive Adhesives (continued) Certified Colloidal Compounds (continued)
Carbon Conductive Adhesive 502 A High Temperature Conductive Paint
Conductive Adhesive 502 is a combination of specially processed carbon particles in a fluoroelastomer resin system designed to provide high resistance values. In its cured form, it exhibits both high and low temperature flexibility and moisture resistance.
Advantages: Withstands ambient temperatures of over 500°F (260°C)
Remains flexible over temperature range of –40°F to over 500°F (260°C)
Cures at room temperature Good adhesion to a variety of substrate Excellent oxidation resistance Ready to use - easy to apply
Typical Properties (as supplied): Pigment Binder Diluent Color
Consistency Density
Solid content by weight Viscosity
Flash point
Typical Properties (as cured): Color
Drying
Air drying of the product is adequate for most applications. To assure complete solvent loss, the coating can be baked for 15 minutes at 302°F (150°C)
RT 12694-30 Carbon Conductive Paint 502 Graphite Spray
An easy to use graphite spray to coat small samples. Its electrical resistance is 1-2 Kohm/sq” at 1 mil thickness. It is fast drying and produces a very flat, thin, and uniform graphite film. Its service temperature is up to 204°C.
12648 Graphite Spray 450g 12648 30 g
Specially Processed Carbon Fluoroelastomer
Methyl Ethyl Ketone (MEK) Black Fluid
7.2lbs/gal (0.87 kg/l) 13%
600 ± 200 mPas
(Brookfield RVT @ 20rpm) 23°F (-°5C)
Shelf life for this product is one year under original seal. Store in cool place Black
Maximum service Temperature: 525°F (275°C) Sheet resistance
130 ± 100 ohms/
sq.in./1 mil dry film Epo-Tek®
EPO-TEK — Epoxy Conductive Adhesive EPO-TEK®
H20E
H20E is a two component, 100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1.
Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300 – 400°C)
Epo-Tek H20E is also a conductive adhesive of choice for old or new applications.
Its applications include: chip bonding and electronic bonding as well as SEM mounting.
H20E contains no solvents and will not outgas.
When cured, H20E is resistant to solvents, resin and moisture
Long Pot life (2½ days) Shelf life is one year when store at 23°C
Maximum Bond Line Cure Schedules:
Typical Properties (to be used as a guide only, not a specification) 175°C......................15 minutes
150°C .............................1 hour
Physical Properties: Color:
Consistency:
Part A – silver; Part B – silver Smooth, thixotropic
Viscosity (@ 100 RPM / 23˚C): 2,200 – 3,200 cPs Thixotropic Index:
3.69
Glass Transition Temp (Tg): ≥ 80˚C (Dynamic cure 20 – 200˚C / ISO 25 Min; Ramp -10 – 200˚C @20˚C/Min)
Coefficient of Thermal Expansion (CTE):
Shore D Hardness:
Below Tg: 31 x 10-6 Above Tg: 158 x 10-6
75
Lap Shear Strength @ 23˚C: 1,475 psi Die Shear Strength @ 23˚C: ≥ 5 kg / 1,700 psi Weight Loss:
Degradation Temp (TGA): Operating Temp:
Storage Modulus @ 23˚C: Ion:
Particle Size:
Thermal Properties Thermal Conductivity: Thermal Conductivity:
Thermal Resistance:
Epo-Tek® Solder:
RT H20E: 12671-20E Epo-Tek®
808, 700 psi Cl-
@200˚C: 0.59%; @250˚C: 1.09%; @300˚C: 1.67% 425˚C
Continuous: -55˚C to 200˚C Intermittent: -55˚C to 300˚C
73 ppm; Na+ ≤ 45 microns
Electrical Properties: Volume Resistivity @ 23˚C: ≤ 0.0004 Ohm-cm
2.50 W/mK
29 W/mK Based on Thermal Resistance Data: R=L x K-1 x A-1
(Junction to Case): TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick)
6.7 to 7.0˚C/W 4.0 to 5.0˚C/W
H20E Adhesive 1 oz continued 62 2 ppm; NH4+ 98 ppm; K+ 3 ppm in/in/˚C in/in/˚C
120°C............................2 hours 80°C............................24 hours
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