EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION INSTRUMENTATION ASAP-1 IPS Digital Selected Area Preparation System
Product Highlights Suits all sizes of die - package, wafer and board-level
Real Time Video Monitor with system parameter
Touchscreen control with physical joystick & controls
Rigidized Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
X, Y and Z axes all have deep sub-micron accuracy
Accurately decaps, then thins substrate and polishes
Since product launch, ASAP-1® hardware has become the standard piece
of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC has produced leading solutions for backside preparation since 1999. With over 300 ASAP-1 units installed in Semiconductor industry labs throughout the world, we are proud to introduce the ASAP-1®
IPS.
Enabling The Next Generation Of Failure Analysis Ever since the inception of the ASAP-1 Project, ULTRA TEC’s goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB’s. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1®
IPS.
IPS offers deep sub-micron control on X, Y and Z axes, making it 'hands-down' the most accurate system ever seen in the market.
Digital Control... Done Right! ASAP-1®
Much More Than A Mill ASAP-1®
IPS enhances the market-
leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1®
IPS real time monitor shows X, Y & Z Positions, speeds feeds & tool diameter
IPS introduces
a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented 'float down' polishing head design is retained,
SPECIFICATIONS Z-Vertical Direction Precision: 0.04 microns (40 nanometers)
Table Precision (X& Y Travel): 0.2 microns (200 nanometers) Table Travel Amplitude: 100mm x 100mm
Polishing Method: Patented ASAP-1 Float-down head, with Z-lock, enhanced with electronic sensors and tool patterns
Video: Real-time machine vision with 6.5 inch video monitor. External Video Output (NTSC)
Programming Input Method: Touchscreen with joystick and 3 phys- ical rotary encoders
Machine Vision: Real-time Video of overlaid with stage and process variables.
Tilt Control: Computer-aided 2-circle tilt control, ULTRACOLLIMATOR Measurement (option)
Force Control: 1000grams (max) with 1 gram precision. Overall accuracy +/- 10 grams Recipe Load & Save: USB Port, for removable flash drive (up to 2Gb)
Machine vision, laser scan, & illumination provide feedback of system parameters
and enhanced with the use of force feedback. to achieve the quality of final polish demanded by customers for backside microscopy, Laser scan, FIB and SIL.
146
Z Position Touch-off Method Mechanical Positioning with Force-feed- back (option) sensors. X & Y Position: LASER Targeting Power Consumption: 300 Watts Maximum in use Power Requirements: Universal: 100-120VAC; 200-240VAC
Footprint: 19 inches (480mm) Width x 25 inches (635 mm) Depth x 22 Inches (560mm) Height
Improved System Controls The dedicated machine-vision monitor provides an 'always on' realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed!
A touchscreen interface, a physical joystick and encoders -- alongside a suite of intuitive software and hardware features -- empowers the FA technician & engineering professional for the next generation of failure analysis.
The Touchscreen offers a powerful user interface - enhanced by physical controls
Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
Intuitive menus provide a powerful, easy to use, system
USB Flash Driveinterface for preparation recipe storage
Short set-up and process times
Accurate die-tilt adjustment ‘on the fly’
Bench-top & Quiet in Operation
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