EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION CLEAVING & SCRIBING SYSTEMS AND TOOLS LatticeAx™ Cleaving Systems (continued)
respectively. Cleaving is fast (<5 minutes), clean and repeatable.
While a manual scribe and cleave is fast (about 2 minutes), it is not repeatable or accurate. Accuracy can be improved when the manual scribe is made while viewing the
sample with a stereoscope (50-100µm). In both cases, targeting accuracy and quality varies by user.
In the past decade, automated micro-cleaving tools improved targeting accuracy and sample quality needed for high resolution SEM imaging. These improvements came with strict pre-preparation requirements, lower throughput, inability to handle small and thin samples, and much higher cost than manual cleaving.
features and process optimizes the very basic elements of the manual cleaving technique and overcomes manual cleaving disadvantages, such as lack of accuracy and repeatability.
The LatticeAx™
Precision mechanics integrated with high resolution optics and independently controlled sample and indenter stages
LatticeAx™ indents. A shallow indent is made on the surface of the sample. No scribing
Clean and accurate cleaves in <5 minutes. No dust, just a straight, long cleave with a mirror finish
Fast – 5 Minu te Process • Quick targeting with variable zoom
• Digitally displayed real-time imaging
Versatile – wide range of sample size, substrate type and top layers • Si-GaAs-Sapphire • Cu • Resist • Polyimide • Passivation • Films
Applications • Site specific cross-section for SEM analysis • Target localization prior to FIB or broad ion beam • Downsize samples for SEM with height restriction • Cleaving to create uniform samples for other analysis tools with non- wafer scale stages
• Vertical, mirror image cleaving for photonics analysis
Setup Requirements • Flat, stable surface to support the LatticeAx™ x 61cm surface space
at least 18" x 24" or 41cm
• Power for the vacuum pump (110V or 220V depending on local requirements)
• Computer running Windows 7 or XP with mouse, keyboard, monitor, video cable to the monitor
Options • The Cleaving Station • Cleaving Kit • Marker-Scriber Kit • Lattice Scriber • CleanBreak Pliers
LatticeAx™ 120 Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2 minutes.
By using the Patent Pending LatticeAx™ base
platform, every user can cleave samples with wide variation in size, thickness and materials at high quality within 2 minutes. It uses precision knobs to produce fine, reproducible surface indentation followed by slow, controlled cleaving. The indenter is controlled by a stage with 5µm steps. Combine this tool with your own optical microscope to improve cleaving accuracy.
The LatticeAx™ 120 Features: Accuracy — Determined by the scope and software you provide.
Vision Package — Combine this tool with your own optical microscope to improve cleaving accuracy. Includes: LatticeAx™
NEW! LatticeAx™ 225
Accurate Indent and Cleaving System The addition of high magnification imaging enables accurate indenting, resulting in samples cleaved with high accuracy. The LatticeAx™
225
delivers 20µm accuracy with high quality cleaved surfaces in 5 min. It integrates the patent pending LatticeAx™
base with an industrial platform customized for indenting and cleaving.
The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. With realtime imaging the indent is placed accurately with respect to the target making cleaving sample target simple and fast for all users. The 225 accepts samples with a wide range of sizes, thicknesses and materials.
The LatticeAx™ Sample Platform for LatticeAx™
225 combined with the Large (EMS Cat
#7653) is commonly used to downsize wafers
up to 300 mm. It can indent and cleave cleanly, not generating excessive silicon dust and resulting in clean edges. Because of the accuracy of the indent die can be excised without loss of material.
The LatticeAx™ 225 Features
±20 Microns Cleaving Accuracy Accurate and Repeatable Indent and Cleave Clean and high quality mirror finish cleaved face Simple to operate No maintenance contracts
The LatticeAx™ 225 Benefits All the features of the LatticeAx™ 120 base tool
Robust workstation platform designed for indenting and cleaving USB2 digital microscope with realtime digital imaging interface* Microscope mount with fine focus control Vacuum pump to secure sample with pneumatic valve switch *Computer not included
121 , 1 pre-installed Indenter, Vacuum Pump, Transport Case
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