EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION CLEAVING & SCRIBING SYSTEMS AND TOOLS


LatticeAx™ Cleaving Systems Meet the LatticeAx™


— the small, accurate, fast,


low-cost cleaving solution, suitable for any lab. Overview


The LatticeAx™ is a precision cleaver that fits in the palm of your hand. In an amazingly small footprint (4" cube, 100mm³), the patent-pending "Ax" and process are designed to assist the user to cleave site specific targets, as well as wafers, strips, or pieces to precisely sized samples with localized targets. One of the smallest, most efficient silicon wafer cleaving tools in the world, the LatticeAx™ is sure to revolutionize your workflow.


Using the LatticeAx™The LatticeAx™ features and process optimizes the very basic elements of the manual cleaving technique and overcomes manual cleaving disadvantages, such as lack of accuracy and repeatability. This machine-assisted hybrid cleaving tool bridges the gap between manual scribing and fully automated cleaving. It increases success rate by any user while keeping costs down. It takes little training and users will be “cleaving in minutes and experts in a day.”


LatticeAx™ – New Way of Cleaving LatticeAx™ is fundamentally different from manual cleaving because it


a) Replaces human vision with a high-magnification digital microscope to precisely select the target


b) Replaces hand coordination with precision positioning knobs, resulting in a repeatable process that is not user-dependent


c) Produces an indent on the surface <1 mm in length, ~10µm in width at a very shallow depth


d) Employs a controlled "slow cleave" that follows the crystal plane, rather than a break along a scribed line


This machine-assisted hybrid cleaving tool bridges the gap between manual scribing and fully automated cleaving. It also increases success rate by any user while keeping costs down. Cleaving with the LatticeAx™ 220 and 420 products deliver 20 and 10µm targeting accuracy


The Process


Using the LatticeAx™, wafer cleaving is accomplished in three basicsteps that compliment existing skill sets used in wafer analysis. It’s simple. Just SET...


INDENT... CLEAVE... RESULT


Select target under high magnification (up to 80x) and use micrometer to position the indenter tip.


120


A precision control knob coupled with a sharp indenter tip results in fine indentation at the edge of the sample.


Cleaving position consists of a set cleaving pin and a cleaving bar used to apply uniform pressure to achieve a controlled cleave.


Cleave is always clean and precise.


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