EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION


INSTRUMENTATION  MicroCleave™


The MicroCleave™


Kit - Model 520


technique is a relatively simple and inexpensive method of producing superior cross sectional TEM specimens. For speed in preparation, it is unsurpassed.


One limitation of the technique is that it does require the substrate material to be cleaved or fractured. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been extended to other substrates, such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly examining coatings and thin films very soon after they are deposited.


FEATURES


 Relatively simple and inexpensive method for the preparation of TEM cross sections, where specific information is not required.


 Ideal when sample availability is limited as it requires very little starting material.


 While originally designed for semiconductors, the technique has been applied to glass, silicon carbide, quartz, sapphire, and other brittle materials.


 No ion milling is required. Therefore, no amorphization, no heating effects, no ion implantation, and no preferential sputtering.


 The MicroCleave™


graphic orientation and determination in the TEM  The MicroCleave™


sample is ideally suited for rapid crystallo- technique is fast and typically requires prepara-


tion times of less than 1 hour. This makes it particularly well suit- ed for rapid examination of coatings and thin films shortly after deposition.


ORDERING INFORMATION 50130-20


Complete Kit includes: Product # Description


50130-50 50130-51 50130-52 50130-53 50130-54 50130-55 50162.80 50162-81 50130-56 70030


62107-ST 50130-59 71700


50130-60 60968


50130-61 50130-62 71140


50130-63 66100-20 50130-64 72350


An X-ray mirror consisting of 45 layers of alternating Mo/Amorphous Si (7.0 nm period) on Si substance. Image courtesy of John McCaffrey – National Research Council of Canada


References: 1. Ultramicroscopy, 38 (1991) 149, John P. McCaffrey.


2. TEM Samples of semiconductors Prepared by a Small-Angle Cleavage Technique, J.P. McAffrey, Materials Research Society, Vol. 254 (1992).


3. Microscopy Research and Technique, 24 91993) 180, j. p. McCaffrey.


4. A simplified Method for Modifying TEM Copper Grids for Use with Small Angle Cleavage Technique, Microscopy Today (96-4) (1996, Scott D. Walck.


5. The Small Angle Cleavage Technique: An Update, Scott D. Walck and John McCaffrey. Materials Research Society, Vol. 480 (1997).


158 50130-21 Model 520-B - Basic MicroCleave™


Basic Kit includes: Product # Description


50130-50 50130-51 50130-52 50130-53 50130-54 50162-80 50130-61 50162-81


Lapping Fixture, Model 150MC #5201 Grid Bending Jig with Cover Engraved Mounting Block for 150MC PTFE Block Post-it Block


Model 180 Lapping Tray


Petri Dish with Mounted Slide Angle Guide for Model 180


Kit Qty


each each 3/pk 5/pk each each each each


Multiple Quantum Well structure grown by MBE showing the thickness terraces possible with a MicroCleave™


sample.


Courtesy of Scott Walk – Materials Directorate WPAFB. (Now with PPG Industries)


50160-25 72703-D 50419-20 50130-66 50350-35 50130-67


Model 150MC Lapping Fixture #5201 Grid Bending Jig with Cover Engraved Mounting Block for 150MC PTFE Block, 1x1x0.50” Post-it Block Lantern Slide


Model 180 Lapping Tray Angle Guide for Model 180 Silicone Mat Coarse Scribe Micro Scribe


Tab Grid (100/pk) Lens-Tissue


Transparent Ruler


Tri-pour Beaker with Lid, 50ml, 10/pk Petri Dish with Mounted Slide Petri Dish with lids


100-position Grid Storage Box Silver Epoxy


Red Sable Brush, Size 2/0


Mixing Tray (Aluminum Dish), 10/pk Hot/Stirrer Plate Cooling Tray


Tweezers #5, 45 Degree Bent Quick Stick - Mounting Wax


Lint-Free Cloth, size 4 x 4”, 10/pk Diamond Lapping Film, 30 micron Squeegee


Model 520 MicroCleave™ Complete Kit Qty


each each 3/pk 5/pk each each each each each each


15/pk 5/pk each 5/pk each each 5/pk 5/pk each each each each each 5/pk each each each each


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