EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION EQUIPMENT & ACCESSORIES
EMS 300T D Plus Dual Target Sequential Sputtering System
QUICK OVERVIEW
Suitable for multi-layer sequential sputtering of two materials, the EMS300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets. When not in use the targets are shuttered for protection from contamination.
KEY FEATURES Capable of achieving vacuum of 5 x 10-5
mbar
New touch and swipe capacitive screen USB port for upgrades and download of process log files Multiple-user profiles can be set up on one machine New software sorts recipes per user according to recent use 16GB of memory can store more than 1000 recipes New multi-color LED visual status indicator Interchangeable stage options Three sputter heads for large area deposition of different materials Single head selection for small samples
PRODUCT DESCRIPTION Improved Interface
• Dual-core ARM processor for a fast, responsive display • Capacitive touch screen is more sensitive for ease of use
• User interface software has been extensively revised, using a modern smartphone-style interface
• Comprehensive context-sensitive help
• USB interface allows easy software updates and backing up/copying of recipe files to USB stick
• Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters.
• 16GB of flash memory can store more than 1000 recipes
• Quick and easy creation of process sequences with a simple copy, drag and drop operation
Allows multiple users to input and store coating recipes. New feature to sort recipes per user according to recent use.
System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.
Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.
Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.
Detachable chamber with built-in implosion guard Removable glass chamber and easily accessible base and top plate allows
Recommended applications for EMS300T D Plus: • Ideal for multi-layer coating
• Adhesion studies These products are for Research Use Only.
for an easy cleaning process. Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples. Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.
Dual head sputtering – for sequential sputtering The EMS 300T D Plus has two independent sputtering heads to allow sequential sputtering of two different metals without the need to 'break' vacuum, for example, a thin 'seeding' layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidizing sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.
Multiple stage options
The EMS 300T D Plus has substrate stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except the rotary planetary stage). A swinging arm stage drive is supplied as standard, which is a stage drive and positioning mechanism that positions the stage under the correct target. Rotation speed is variable between 14-38 rpm.
In addition a flat, adjustable stage capable of accepting 4" (101.6 mm) wafers is supplied as standard with the EMS 300T D Plus.
As an accessory, a 6" wafer stage is available, which is a flat adjustable stage capable of accepting 6" or 150 mm wafers. The stage includes two masks for improving uniformity of coating.
Rotation stage – 50 mm Ø. This stage only rotates and has no tilt or height adjustment.
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