search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION EQUIPMENT & ACCESSORIES


 EMS 150R Plus Rotary Pumped Coater


QUICK OVERVIEW


The EMS 150R Plus is suitable for use with Tungsten/LaB6 SEM and Benchtop SEM.


Typical uses


Sputter coating of noble metals using the EMS 150R S Plus & EMS 150R ES Plus


Recommended for magnifications: • Up to x 50k using Au, Au/Pd • Up to x 100k using Pt (optional)


Carbon cord coating for elemental analysis using the EMS 150R S Plus & EMS 150R ES Plus.


KEY FEATURES  Capable of achieving vacuum of 2 x 10-3


mbar


 New touch and swipe capacitive screen  USB port for upgrades and download of log files  Multiple-user profiles can be set up on one machine  New software sorts recipes per user, according to recent use  16GB of memory can store more than 1000 recipes  New multi-color LED visual status indicator  Interchangeable stage options and plug-in heads


PRODUCT DESCRIPTION The EMS 150R Plus is available in three configurations:


• EMS 150R S Plus – An automatic sputter coater for non-oxidizing metals. Available sputtering targets including gold, gold/palladium and platinum.


• EMS 150R E Plus – An automatic carbon cord coater for SEM applications such as EDS and WDS.


• EMS 150R ES Plus – A combined system system capable of both sputtering and carbon coating. The deposition heads can be swapped in seconds.


Improved Interface • Capacitive touch screen is more sensitive for ease of use


• User interface software has been extensively revised, using a modern smartphone-style interface


• Comprehensive context-sensitive help screen


• USB interface allows easy software updates and backing up/copying of recipe files to USB stick


• Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters.


• 16GB of flash memory can store more than 1000 recipes • Dual-core ARM processor for a fast, responsive display


Allows multiple users to input and store coating recipes, with a new feature to sort recipes per user according to recent use.


Intelligent system logic automatically detects which insert is in place and displays the appropriate operating settings and controls for that process.


System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.


176


Recommended applications for EMS 150 R Plus: • Low and medium magnifications


• SE signal boost (1nm or less) • Table-top SEM coating • Elemental analysis • Copper metallization layers


These products are for Research Use Only.


Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.


Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.


Automatic, controlled pulsed carbon cord evaporation


The carbon evaporation process can be terminated using the optional film thickness monitor, which incorporates a quartz crystal monitor, fitted as standard on E and ES models. This recipe ensures that carbon is evaporated in short controlled pulses, which has two effects: protecting the sample from heating and ensuring the accuracy of the film thickness monitor. Pulsing also significantly reduces the amount of debris (including large carbon fragments) associated with traditional carbon "flash" evaporation. Pulsed and ramped carbon rod recipes are supplied as standard.


Cool Magnetron Sputtering


Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136  |  Page 137  |  Page 138  |  Page 139  |  Page 140  |  Page 141  |  Page 142  |  Page 143  |  Page 144  |  Page 145  |  Page 146  |  Page 147  |  Page 148  |  Page 149  |  Page 150  |  Page 151  |  Page 152  |  Page 153  |  Page 154  |  Page 155  |  Page 156  |  Page 157  |  Page 158  |  Page 159  |  Page 160  |  Page 161  |  Page 162  |  Page 163  |  Page 164  |  Page 165  |  Page 166  |  Page 167  |  Page 168  |  Page 169  |  Page 170  |  Page 171  |  Page 172  |  Page 173  |  Page 174  |  Page 175  |  Page 176  |  Page 177  |  Page 178  |  Page 179  |  Page 180  |  Page 181  |  Page 182  |  Page 183  |  Page 184  |  Page 185  |  Page 186  |  Page 187  |  Page 188  |  Page 189  |  Page 190  |  Page 191  |  Page 192  |  Page 193  |  Page 194  |  Page 195  |  Page 196  |  Page 197  |  Page 198  |  Page 199  |  Page 200  |  Page 201  |  Page 202  |  Page 203  |  Page 204  |  Page 205  |  Page 206  |  Page 207  |  Page 208  |  Page 209  |  Page 210  |  Page 211  |  Page 212  |  Page 213  |  Page 214  |  Page 215  |  Page 216  |  Page 217