EMS MATERIALS SCIENCE & METROLOGY CATALOG 2019–20 EDITION CLEAVING & SCRIBING SYSTEMS AND TOOLS LatticeAx™ Cleaving Systems (continued)
Accessories for LatticeAx™ Small Sample Cleaver
Safely cleave samples into chips as small as 2x2mm
LatticeAx™ Diamond Indenter Custom diamond indenter for the LatticeAx™. The LatticeAx™ indenter is easily replaced by the user and comes with screws, allen wrench and installation instructions. Polished end for improved positioning.
LatticeAx™ High Angle Diamond Indenter Standard 1 mm indent. Polished end for improved posi- tioning. Indenter is has a 60 degree angle and is used for applications that routinely require cleaving targets with ultra high accuracy.
The novel sample holder allows samples from 4-10mm to be held during indenting and cleaving. No more handling samples directly with fingers. Gloved hands are ok, the holder has no screws, springs or pins.
For more information, see page 119.
Large Sample Platform for LatticeAx™
Begin your sample preparation with a "clean" edge
Extend LatticeAx™ cleaving to 300mm diameter wafers
The Large Sample and Whole Wafer
Cleaving Accessory (LSPL) supports samples up to 300mm during indenting and cleaving. The LSPL fits on all LatticeAx™ models. This accessory easily attaches to the LatticeAx™ with a single set-screw.
The sample is supported by four delron arms that do not damage the backside of the wafer. The indenter position extender knob allows the user to access to the LatticeAx positioning knob even with a large sample mounted so fine positioning of the diamond indenter is possible.
Large sample platform with wafer in place.
LatticeAx™ “Short” Indent-Diamond Indenter Used when targets are close to the sample edge or the sample is fragile (thin) or small. It is installed in the same shank as the standard indenter.
LatticeAx™ Complete
Options Package Make sure you have everything to set up your cleaving workflow. This package includes 2 spare
LatticeAx diamond indenters and everything necessary for cleaving large substrate, wafers and pieces.
• The LatticeAx™ Diamond Indenter: The LatticeAx Indenter is replaced by the user and comes with allen wrenches and installation instructions.
• Cleaving Kit: The complete tool set to get from wafer to cleanly cleaved pieces. This is a critical step to getting the best crosssections. The kit includes wafer mat, scribes for marking and scribing, pliers for cleaving, rulers and instructions.
• Diamond Scriber: Pen style, optimal for top down scribe • Diamond Scriber: Straight tip, optimal for top down precise marking and/or scribing
• Diamond Scriber: 30 degree tip, optimal for top down precise marking and/or scribing
• L-Square: 24" x 8½", phenolic, non-warping, ruler acts as guide for macro cleaving up to 300mm wafers without damaging the top surface of the cleaving station
• CleanBreak Pliers: 6" wafer-cleaving pliers. Simple and clean way to cleave (post scribe) wafers to strips and smaller pieces. ¾" jaw
• Large Cutting Mat: Wafer-cutting mat, self healing, double sided, green and black, 18" x 24"
• Small Ruler Mat: Self healing, Small wafer piece ruler mat, double sided, green and black, 3½" x 5½"
ORDERING INFORMATION Cat #
Description
7640 7641 7650 7651 7652 7653 7643 7655 7656 7649
LatticeAx™ 120 Cleaving System LatticeAx™ 225 Cleaving System
LatticeAx™ 420 (110V) Cleaving System LatticeAx™ 420 (220V) Cleaving System Small Sample Cleaver Large Sample Platform
LatticeAx™ Diamond Indenter
LatticeAx™ High Angle Diamond Indenter LatticeAx™ Short” Indent-Diamond Indenter LatticeAx™ Complete Options Package
Qty.
each each each each each each each each each each
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