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Page 90


Tampa, FL — Europlacer is launching its brand-new, flagship placement sys- tem in the U.S. The Atom range includes the super-flexible Atom 3 and high-speed Atom 4 configurations. Reportedly, the Atom 4 is capable of


www.us-tech.com six-figure placement rates.


Atom configurations sit at the top of the company’s range of plat- form products, yet remain comple- mentary to and compatible with all existing models from the past two


decades. The new platform combines high-speed placement capability with Europlacer’s placement flexibil- ity and accuracy.


At the core of the new high- speed capability is the pioneering Pulsar pipette head. Each head has eight nozzles that handle compo- nents from 01005 (0402 metric) pro- files up to 0.02 in.2 (13 mm2) in size, while delivering high accuracy. Designed to be completely mainte- nance-free, Pulsar heads use advanced titanium and titanium- nitride materials, and self-lubricat- ing diamond nanocoatings.


The new Atom 4 is equipped with four independent axes, each fit- ted with a high-speed Pulsar head to deliver raw performance at place- ment rates up to 104,000 CPH. The Atom 3 machine combines a pair of Pulsar heads on independent axes with Europlacer’s eight-nozzle turret head on a third axis to offer a blend of high speed and flexibility for devices up to 3.9 x 3.9 in. (9.9 x 9.9 cm). Placement rates for Atom 3 can reach 65,000 CPH.


All Atom platforms include robust x/y gantries driven by linear motors with linear encoders for posi- tional accuracy. Precision is retained at high speeds by deploying synchro- nized x-axis linear motor drives at each end of the y-gantry beam. This eliminates lateral flex to allow extrud- ed gantries to be used, reducing mass by 30 percent and permitting accelera- tion to increase from 1.2 to 2.0G. Pulsar heads fly over strategi- cally-positioned imaging cameras


March, 2018 Europlacer Unveils New Atom Placement Platform


during placement, removing the need for vision technology on the head and reducing moving z-axis mass to just 1.8 oz (50g). In turn, this allows z- axis accelerations of 4G for excep- tional speed and precise placement force control.


Atom, Europlacer’s new flagship placement system.


The Atom range maintains Europlacer’s on-machine inventory with 10.4 x 0.3 in. (26.4 x 0.8 cm) reel capacity. The addition of an inter- changeable 30-tray sequencer fits onto the machine like a tape-and-reel cart, without compromising feeder capacity or board size.


The Atom platform is also the first to deploy the company’s patent- ed intelligent conveyor that elimi- nates physical board stops. Instead, these are software-programmable to automatically determine the best stop position for optimum pick-to- place head travel paths, maximizing placement rates and throughput. Contact: Europlacer Americas, 519 US Highway 301 South, Tampa, FL 33619  813-246-9500 E-mail: john.perrotta@europlacer.com Web: www.europlacer.com


See at IPC APEX, Booth 1518 See at APEX, Booth 2215  


Irvine, CA — Expanding on its process-enhancing masking material that was introduced just over a year ago, Henkel has brought to market a next-generation version of the TECH- NOMELT masking solution, which delivers greater visibility for applica-


   


TECHNOMELT AS 8998 masking material.


conventional masking techniques, but is now also available in a colored ver- sion for high visibility of the material, facilitating even more accurate appli- cation and thorough removal from PCBs and components.


The company is also offering brand-new solder pastes — two mate- rials that leverage the chemistry platform of the temperature-stable LOCTITE GC 10. The company is introducing its LOCTITE GC 18, an ultra-low-voiding, Type 4 formula designed to reduce voiding on compo- nents, such as QFNs and LGAs. Also new is the LOCTITE GC 50, a jet- table, Type 5 material to accommo- date applications that incorporate flexible substrates, intricate board configurations and complex, ultra- fine pitch architectures. Contact: Henkel Electronic Materials LLC, 14000 Jamboree Road, Irvine, CA 92606  714-368-8000


Visit Booth 2922 at APEX, San Diego CA, February 27 - March 1. See at APEX, Booth 2922


E-mail: doug.dixon@henkel.com Web: www.henkel-adhesives.com


See at IPC APEX, Booth 3001


Henkel Debuts Masking Materials and Solder Pastes


tion and removal. The new formula offers all of the automation, cost reduc- tion and precision advantages over


 


 


     


  


 


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