March, 2018
www.us-tech.com
Redmond, WA —Data I/O Corporation has introduced its UFS device pro- gramming for automotive applications on the LumenX™ programming plat- form. Automotive electronics program- mable content is projected to grow from 32 GB to over 1 TB and beyond by 2025, driven primarily by the infotain- ment systems in connected and autonomous cars. These applications will transition from eMMC flash mem- ory to universal flash storage (UFS) to meet storage, power and application performance requirements.
UFS has an ultra-high-speed data rate with new high-frequency bus protocols. Advancements in pro- gramming technology are required to communicate with a UFS device and to take advantage of the high per- formance. Without a high-speed, high-capacity programming process capable of leveraging UFS perform- ance, automotive electronics manu- facturers will experience a dramatic decrease in production throughput and an increase in costs.
UFS support will be available on the LumenX desktop or integrated into the PSV5000 and PSV7000 auto- mated programming systems. With over 175 PSV systems installed global-
Omron Intros High-Speed AXI System with 3D CT
Hoffman Estates, IL — Omron has introduced its VT-X750 automatic X- ray inspection (AXI) system for high- quality, in-line inspection of PCBs that contain BGA, LGA and through- hole components.
Omron’s VT-X750 incorporates computed tomography (CT) to pro- vide high-precision, X-ray imaging for precise and reliable analysis of hidden soldered areas. The VT-X750 can detect defects, such as head-in- pillow and voids within BGA and LGA devices. The new inspection system measures solder percentage, including voids in QFNs, and barrel- fill in through-hole devices.
Inspections are performed at speeds greater than 4 ms per field-of-
Our new dual head laser marker combines speed with efficiency. From laser marking to PCB handling solutions, FlexLink automateproduction flow solutions that increases overall line efficiency.
Our new dual head laser marker combines speed with efficiency.
With our range of stand-alone units to turnkey solutions, our PCB include independent modules with a wide variety of functions.
or more information, please contact us at 610-973-8200 or by email at
info.us@
flexlink.com. VT-X750 AXI system.
view (FOV). VT-X750 utilizes CT reconstruction software and com- bines multi-slice data with laser dis- placement technology that gauges the PCB surface for each solder joint, compensating for any warpage and allowing the system to perform cross- sectional analysis at the proper slice- level locations. Contact: Omron Corp., 2895 Greenspoint Parkway, Suite 200, Hoffman Estates, IL 60169 847-843-7901 Web:
www.omron.com
See at IPC APEX, Booth 2100
flexlink.com From laser marking to PCB
handling solutions, FlexLink delivers automated production flow solutions that increases overall line efficiency.
With our range of stand-alone units to turnkey solutions, our PCB Handling solutions include independent modules with a wide variety of functions.
For more information, please contact us at 610-973-8200 or by email at
info.us@
flexlink.com.
Visit us at APEX
booth #2223
ly, existing customers can protect their investments and easily upgrade their PSV systems to support UFS as their production requirements change. The combination of LumenX programming technology in a PSV system delivers performance, flexibility and through- put for the lowest total cost.
The PSV7000 is an automated programming solution with the speed, flexibility, fast changeover, and small parts handling to manage any job for a low total cost of ownership. Engin- eered for velocity and versatility, the PSV7000 combines robotics handling with LumenX programming technolo- gy for fast device programming and high socket density.
A comprehensive suite of process control software applications, along
PSV7000 automated
with fiber laser marking and 3D copla- narity component inspection meets the demanding process requirements for automotive electronics applica- tions. The PSV7000 supports both FlashCORE III and LumenX pro-
Page 113 Universal Flash Storage Programming from Data I/O
grammers concurrently installed. Current customers with PSV7000 sys- tems have their investments protected as they can upgrade their systems to add LumenX programmers alongside their current technology.
The combination of ultra-fast read/write and download speeds, high socket capacity and high throughput allows manufacturers using one PSV7000 to program what previously required multiple systems. Contact: Data I/O Corp., 6464 185th Avenue NE, Suite 101, Redmond, WA 98052 425-867-6922
E-mail:
higginj@dataio.com Web:
www.dataio.com
See at IPC APEX, Booth 2615
We move electronics. Boost your production efficiency
FlexLink is part of Coesia, a group of innovation-based industrial solutions companies operating globally headquartered in Bologna, Italy.
www.coesia.com
See at APEX, Booth 2223
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