March, 2018


www.us-tech.com


Page 65


Quality-Driven Production Drives Inspection and Measurement in M2M Communication


By Yasuo Watabe, Sales Promotion Group Leader, Saki Corporation


toward the smart factory, with its Industry 4.0 and machine-to-machine (M2M) initiatives. It is relatively easy for machines to connect,


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but it is the communication of real-time, valid and accurate data that is key to M2M communi- cation. Absolute precision is required. With the introduction of Saki’s fifth generation 3D 3Di automated optical inspection (AOI) and 3D 3Si solder paste inspection (SPI) systems, Saki has developed its concept of “QUALITY DRIVEN Production,” or QDP, which is making true M2M communication a reality.


What is QDP? QDP is a set of tools that


ensures that the entire AOI/SPI processes are under control. QDP improves inspection process stability, maximizes line first-pass yield, mini- mizes operating and quality-related costs, and provides full traceability of the inspection process. QDP benefits the production environment by keep- ing product quality and the inspec- tion process under control, while improving manufacturing processes. The QDP concept combines


three key factors: advanced hard- ware, advanced software and applied technology. Delivering highly accu- rate and repeatable image acquisi- tion that results in absolute measure- ment is a requirement for inspection. In high-speed manufacturing, vibra- tions and machine operation can eas- ily throw a system off kilter, move a component or change the coordinates. The slightest change alters the tra- jectory of the inspection process, thus the data received from one machine might no longer be accurate when it is communicated to another machine. For Saki, accuracy starts with a


machine gantry that has a frame with enhanced stiffness for accurate positioning and a closed-loop, dual servo-motor drive system with high- resolution linear scale. Saki’s propri- etary hardware and software are combined in a stable system that pro- duces position accuracy of 0.35 to 0.1 mil (9 to 3 µm), at three sigma. Tests done using Saki’s 3D AOI


system, showed that when coordinate positions were measured for deposi- tion mark detection, after five hours of continuous operation, the process capability index (Cpk) for the x and y axes showed 1.8 and 2.7, respective- ly, indicating that a ±0.4 mil (±10 µm) accuracy was maintained for the area within the inspection window. To accommodate diverse applica-


tion needs and markets, today’s inspec- tion and measurement systems need to encompass a broad spectrum of capa- bilities and configurations. They must be flexible enough to make on-the-fly adjustments to improve productivity, efficiency and shorten delivery time. Flexibility provides options and gives the manufacturer a path for growth and the ability to handle future needs. Saki’s AOI and SPI systems have plat- forms for different board sizes and con- figurations, handling PCBs in medium, large and extra-large sizes for large components, as well as incorporating dual lanes. Using common hardware and


software for both the SPI and AOI systems results in shorter delivery


See at APEX, Booth 3606


uality is more important than ever, as the electronics industry faces new tech- nologies, market realities and the race


time and reduced training time, because it is only necessary to learn one common system for operation and maintenance. The company’s inspection systems even provide the flexibility to choose the resolution that best fits the appli- cation. Saki’s new 3D AOI series is the first to offer a choice of three resolutions — 0.27, 0.47 and 0.7 mil (7, 12 and 18 µm).


The Role of Hardware Hardware plays a key role in productivity.


3Si/3Di series inspection systems for large boards (left) and for medium boards (right).


According to Saki’s tests, its 3Di has the fastest Continued on next page


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