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Page 124


www.us-tech.com


Test for gross and fine leaks in as little as 6 minutes.*


March, 2018 EMI Shielding Fan Vents


Only NorCom optical leak technology detects both gross and fine leaks in hermetically sealed packages, this fast. Instead of using multiple technologies


and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™


series inspects hermetically sealed components to


MIL-STD 883 requirements either in seam seal trays, or when already mounted to circuits boards and assemblies. It automatically rejects failed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.


NorCom 2020™


Try it free. Send us your package samples today, for a leak test evaluation and report at no charge. *Note: Test time is dependent on package volume


www.norcomsystemsinc.com


610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA


Plymouth, MA — Tech-Etch’s new 8200 series shielded fan vents are designed to provide EMI shielding and maximum airflow, without degrading fan output. These vents provide a low-cost option to perforat- ed metal when airflow rates are crit- ical. The company stocks fan vents in seven sizes corresponding to indus- try-standard fans with four-hole mounting. Shielding performance is achieved from 1/8-cell aluminum honeycomb panels mounted in high- strength extruded aluminum frames with beryllium copper shielding strips for shielding from the frame to the enclosure. Since the honeycomb design


yields 97 percent open vent area, unrestricted airflow results in reduced turbulence, as well as lower noise levels than vents constructed from perforated metal. Dust screens,


made of multilayer expanded alu- minum can be added, but airflow will be restricted. Tech-Etch manufac- tures a complete line of standard and


Tech-Etch Releases


8200 series EMI shielding fan vents.


custom shielding products for both the


commercial and military markets. Contact: Tech-Etch, Inc.,


45 Aldrin Road, Plymouth, MA 02360 % 508-747-0300 E-mail: sales@tech-etch.com Web: www.tech-etch.com


Grieve Builds 550°F Shelf Oven


Round Lake, IL — Grieve has devel- oped its No. 859, a 550°F (288°C) shelf oven currently used for drying powdered resin in trays at a cus- tomer’s facility. Workspace dimen- sions of this oven measure 3.7 x 2.5 x 5 ft (1.1 x 0.76 x 1.5m). This oven has 4 in. (10.2 cm)


insulated walls, Type 430 stainless steel interior and four independent doors for access to the workspace, each opening 20.5 in. (52.1 cm) wide x 28.5 in. (72.4 cm) high. Features include 32 trays, 19 x 29 x 2.5 in. (48.3 x 73.7 x 6.4 cm) deep, a weekly timer to start and stop the oven, and a digital timer for each compartment with a button and pilot light to indi- cate the end of each cycle. Controls on the No. 859 include


a digitally indicating temperature controller, manual reset excess tem- perature controller with separate contactors, recirculating blower air-


No. 859 shelf oven. flow safety switch, and a 10 in. (25.4


cm) diameter circular chart recorder. Contact: Grieve Corp., 500 Hart


Road, Round Lake, IL 60073 % 847-546-8225 fax: 847-546-9210


E-mail: sales@grievecorp.com Web: www.grievecorp.com


Richardson RFPD Offers LDMOS Transistor from NXP


Geneva, IL — Richardson RFPD, an Arrow company, is now offering a new RF power LDMOS transistor from NXP Semiconductors, along with full design and support capabil- ities.


The AFV10700H/AFV10700HS,


available in bolt-down and solder- down styles, is designed for pulse applications operating at 1,030 to 1,090 MHz and can be used over the 960 to 1,215 MHz band at reduced power. It outputs 700W P1dB at 1,090


 RoHS


MHz, with 50V and 56 percent effi- ciency. If operated at 52V, it can achieve 850W P1dB at 1,030 MHz, with 52 percent efficiency. The new device contains highly integrated on- chip pre-matching and exhibits excellent thermal resistance. The new LDMOS transistor is


suitable for use in defense and com- mercial pulse applications with large duty cycles and long pulses, such as friend or foe (IFF), secondary surveil- lance radars, ADS-B transponders, DME, and other complex pulse


AFV10700H/HS LDMOS transistors.


less space than the standard NI-1230 package used by other LDMOS solu-


tions with a similar power level. Contact: Richardson RFPD, Inc.,


1950 S Batavia Avenue, Suite 100, Geneva, IL 60134 % 630-262-6800 fax: 630-262-6850 E-mail: mvitellaro@richardsonrfpd.com Web: www.richardsonrfpd.com


chains. It is the latest addition to NXP’s portfolio of L-band devices for aerospace and defense applications. The AFV10700H/HS is based on


NXP’s Airfast technology and is con- tained in a small NI-780 air cavity package, which occupies 40 percent


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