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www.us-tech.com
March, 2018
Koki Develops Repairable Edge Bond Adhesive
Lake Elsinore, CA — Koki’s JU- 120EB has been developed to replace conventional underfill and edge bond. In addition to high resistance to drop impact and thermal cycling, the edge bond is repairable and can be trans- ported and stored at room tempera- ture, making it an easy alternative to its counterparts. The edge bond is halogen-free and heat-curable. Conventional joint reinforcing
materials pose a risk of cracking a solder joint in CSP and/or BGA pack- ages when subjected to accelerated thermal cycling. This is due to the difference in coefficient of thermal expansion (CTE) among printed cir- cuit board, solder and component. JU-120EB has an optimized CTE, due to its specially engineered filler element, which also ensures excel- lent dispensability. Edge bond is expected to be re-
pairable in order to reuse the compo- nent and board when a joint failure oc- curs. To make the assembly re- pairable, a joint reinforcing material
needs to have plasticity and can be re- moved by heat after curing. On the other hand, increase in plasticity tends to deteriorate surface insulation
JU-120EB-applied BGA.
resistance (SIR), as it allows mobility to the existing ionic substances. JU- 120EB successfully exhibits easy re- pairability and high SIR by carefully selecting a hardening agent and its
formulation technique. Contact: Koki Solder America,
Inc., 18510 Pasadena Avenue, Suite
E, Lake Elsinore, CA 92530 % 951-245-8755 fax: 951-245-8655 E-mail:
roberto@kokiamerica.com Web:
www.kokiamerica.com
See at IPC APEX, Booth 2738
TopLine Highlights CCGA IC Packages
Milledgeville, GA — TopLine is now offering ceramic column grid array CCGA IC packages and particle im- pact dampers (PID). PID technology reduces harmful vibrations and ex- tends hardware life and reliability. TopLine’s CCGA IC packages
are made with non-collapsible solder columns for surface mount soldering on printed circuit boards and provide more compliancy than solder balls (BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. PID is a COTS commercially-
available standard solution, suitable for retrofitting and hardening heritage hardware in the field. PIDs can be sol- der attached like ordinary compo- nents, or attached to the board using permanent epoxy adhesive. TopLine’s
new series of particle impact dampers were invented at NASA’s Marshall Space Flight Center.
TopLine CCGA column. Contact: TopLine Corp., 95
Highway 22 W, Milledgeville, GA 31061 % 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
See at IPC APEX, Booth 3101
See at APEX, Booth 3133
See at APEX, Booth 3002
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