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Page 66


www.us-tech.com


March, 2018


QualityDrives Inspection and Measurement...


Continued from previous page


 


 


 





   


Purex Inc


2246 Palmer Drive Suite 108


Schaumburg, IL 60173 sales@purexinc.com 866-360-5675


Machine-to-machine (M2M) communication.  See at APEX, Booth 3425


ing processing speed to 8.84 in.2/s (57 cm2/s) at 0.7 mil (18 µm) resolution. This is 1.9 times faster than previous 3D AOI models. In addition, Saki’s 3Si 3D SPI system has achieved speeds of up to 9.9 in.2/s (64 cm2/s) at 0.7 mil (18 µm) resolution. Productivity per area increased


by reducing the system’s footprint by 25 percent. Small footprint is a fre- quent requirement for manufactur- ers of products for the automotive


Every key component is monitored along with system conditions and a detailed diagnostic log is recorded. This preventive maintenance plan reduces maintenance time, machine downtime, manpower, and costs.


The Role of Software Saki’s inspection systems are


built on inspection technology that scans the entire board and generates seamless 3D images. Those images


speed in the industry for a 3D AOI system. A cycle time of approximately 15 seconds for mid-sized substrates was achieved by dramatically improv-


Nothing has been compromised. A self-diagnostic, predictive and


preventive maintenance management system ensures stable machine condi- tions and repeatable performance.


Saki’s total inspection solution.


and mobile equipment markets. Saki reconfigured its conveyor system so that substrates can be removed auto- matically during operation, eliminat- ing the reject conveyor at the down- stream end of the process. Capital investment efficiency has been improved, while a wider array of sub- strates can be supported, since the system conveys substrates up to 26.5 lb (12 kg). Saki increased its inspection


area size and the speed of area inspec- tion by incorporating side cameras from four directions for high-speed automatic inspection. This accelerates the carrying-in/out speed and short- ens the time from temporary suspen- sion to production restart. All improvements have been designed together for simultaneous improve- ment of productivity and accuracy.


are the foundation, but it is the soft- ware that is used to program the board, determine what data to col- lect, and translate that data into usable information that makes the images come alive. In other words, the software enables programming, inspection measurement and tuning, and verification. It is all about the data that is communicated to the other machines that enables true M2M functionality. The company’s easy program-


ming function was developed with three concepts in mind: board-less, skill-less and stress-less. The soft- ware saves a full 3D image of the whole PCB assembly, so the operator can create inspection data without using the physical board. Special


Continued on next page


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