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www.us-tech.com
Santa Clara, CA — TEXMAC, the ex- clusive authorized distributor of Takaya flying probers in North America, is introducing its new dual- sided, high-performance APT-1600FD advanced flying probe test system. The APT-1600FD incorporates six top- side flying probes and four bottom-side flying probes, all with the speed and performance of the APT-1400F family. The APT-1600FD architecture provides average head-speed increas- es of up to 50 percent with throughput improvements of 30 to 50 percent over existing models. The APT-1600FD incorporates a new 10-flying-z-axis design, including four vertical flying probes that provide excellent access to
test points where conventional angled probes fail to contact.
Improved soft-touch controls virtually eliminate probe contact marks without compromising probe speed. New probe tips are available, including dagger-head probes for through-holes and inverse cone-head probes for connectors.
This high-end system is also equipped with a laser measuring device to allow compensation for any warpage of the board under test and to accurately measure the height of any component on the board. The completely upgraded x/y stage, com- bined with the positioning accuracy from its enhanced optical system,
provides a 25 percent improvement in probing accuracy over previous- generation Takaya systems. Next-gen, high-precision meas- urement electronics are embedded in the flying heads, greatly improving measurement accuracy and increasing functional capabilities. Enhanced function scanner board and communi- cations software make it easy to con- nect external instrumentation for additional functional-test capabilities. Four LED sensors (two top-side and two bottom-side) are available for the system, capable of measuring both color and brightness. They are driven by an easy-to-use powerful LED sensor-evaluation menu. Also,
March, 2018 TEXMAC Intros Takaya Advanced Flying Probe System
CCD color digital cameras (top- and bottom-side) with high-intensity, ring-shaped, white LEDs to provide lighting for 1D and 2D barcode recog- nition, optical inspection capabilities, and color distinction for vision tests of components, polarity check, offset,
Takaya APT-1600FD flying probe system.
etc. are standard, along with Takaya’s popular color Real Map Package for enhanced off-line pro- gram generation and increased pro- duction availability. Contact: TEXMAC, Inc., 2225 Martin Avenue, Suite K, Santa Clara, CA 95050 408-970-8500 E-mail:
rmckenzei@texmacusa.com Web:
www.texmac.com
See at IPC APEX, Booth 2932 Indium
Formulates Ultra-Low Voiding
Solder Paste
Clinton, NY — Indium Corporation is now offering its ultra-low-voiding Indium10.1HF solder paste. The air- reflow, no-clean, halogen-free, lead- free, solder paste has been formulated for ultra-low-voiding, especially in bot- tom termination component (BTC) assemblies.
Features include: high-ECM performance under low-standoff com- ponents, RF shields without proper ventilation, and components in low- clearance cavities; solder beading minimization; low bridging, slump
Indium10.1HF solder paste.
and solder balling; excellent wetting to a variety of common fresh and aged metallizations and surface fin- ishes; and high print transfer effi- ciency with low variation.
Indium10.1HF is compatible with lead-free alloys, such as SnAgCu, SnAg, and other alloy sys- tems favored by the electronics industry. This solder paste is halo- gen-free per IEC 61249-2-21, test method EN 14582. Contact: Indium Corp., 34 Robinson Road, Clinton, NY 13323 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at IPC APEX, Booth 1625 See at APEC, Booth 1355 and at APEX, Booth 2621
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