March, 2018
www.us-tech.com The company offers tooling spe-
cific to customer requirements. A roll-to-roll film protects the devices during sintering and keeps the die clean. The systems can also run with- out film, in case direct hard sintering is necessary.
Applications and Reliability While Ag sintering has attract-
ed considerable attention, fundamen- tal understanding of the technology is still limited. Recently, several studies have been published that gained insight into the physics of Ag sintering materials and processes. Although our knowledge is far
from complete, there is sufficient infor- mation to suggest that Ag sintering offers basically good shear strength performance and thermomechanical reliability under various conditions. Pressurized Ag sintering has been shown to exhibit better performance
allows the use of silver sintering with wide band-gap semiconductor mate- rials, such as silicon-carbide (SiC) and gallium-nitride (GaN), which can operate at much higher tempera- tures than silicon-based materials. Other applications are also
being investigated. These include SMT applications, interconnect fabri- cation, substrate bonding, printable electronics, and others. In 2016, in the Journal of Electronic Packaging K.S. Siow and Y.T. Lin published an overview of the development of Ag sintering as a function of patent applications, processes, materials, industries, and companies that are commercializing the technology.
A New Bonding Alternative Ag sintering is emerging as a
proven and reliable bonding technol- ogy for high-power and high-power-
Page 79
Silver Sintering: A Reliable Alternative to Lead-Free Bonding Continued from previous page
density applications. The technology is particularly useful for IGBTs and MOSFETs, applications with wide band-gap materials, and devices that require lead-free bonding materials or high performance. Contact: Advanced Packaging
Lead-frame-based power device bonded with silver sintering.
Center, Stenograaf 3, 6921 EX, Duiven, The Netherlands % +31-26-3182200 fax: +31-26-3194999 E-mail:
info@apcenter.nl Web:
www.apcenter.nl and Alpha Assembly Solutions, 300 Atrium Drive, Somerset, NJ 08873 % 908-791-3045 E-mail:
laurie.kneller@
alphaassembly.com Web:
www.alphaassembly.com r
CREATING TOMORROW’S SOLUTIONS
DRIVING TOMORROW’S e-NOVATION: SILICONE – MATERIAL OF CHOICE FOR e-MOBILITY APPLICATIONS.
ALPHA® Argomax® 5020.
and process control when compared with the pressure-less version. Ag sintering can be applied in
many high-power or high-power-den- sity applications. These include solid state lighting, high-power semicon- ductor lasers, solar power, power elec- tronics for wind turbines, and more. Design studies for LED pack-
ages have shown excellent perform- ance and extreme stability against further assembly processes and harsh operating conditions. Also, applications that are sensitive to energy loss are finding Ag sintering to be useful, such as energy harvest- ing in thermoelectric devices (piezo- electric) or printed electronics. Specifically, power applications,
such as IGBTs, RF power, power MOSFETs, and thyristors, stand to benefit from this technology. Potential applications can be found in industries that have to justify the best possible performance against the initial costs of adopting new tech- nology, such as in EVs. Studies have also shown that high-performance automotive applications can be com- bined with high reliability. Another advantage of Ag sinter-
ing is that, after processing, the melting temperature of the layer will be equal to the melting temperature of silver, which is 1,763.6°F (962°C). This means that the maximum junc-
tion temperature (Tj) of a device can be significantly higher than conven- tional die attach materials. As a rule of thumb, materials
can only be worked at up to 80 per- cent of the melting temperature in degrees Celsius. A high-lead solder can be operated up to 356°F (180°C), while an Ag-sintered bond, in theory, can be brought up to 1,400°F (760°C). In practice, silver bonds have been tested up to 932°F (500°C). This
WACKER is a world leader in developing silicone products enabling the electrification of automotive platforms. Our products can be found protecting sensors, electronic control units, power conversion equipment, batteries and displays. WACKER’s broad product portfolio covers:
• Potting gels for protecting sensors to next-generation SiC power modules to battery modules • Multiple adhesive technologies for sealing • Thermally conductive silicones to meet ever-increasing heat loads • Optically clear resins for display bonding and sealing
Wacker Chemical Corporation, 3301 Sutton Road, Adrian, MI 49221, USA TEL: +1 888 922 5374,
www.wacker.com/emobility,
info.usa@
wacker.com
See at APEC, Booth 1618
12:00 PM
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