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www.us-tech.com
March, 2018
MIRTEC: Complete Line of Advanced 3D AOI and SPI Systems
Oxford, CT — MIRTEC is premiering its complete line of 3D AOI and SPI inspection systems at IPC APEX 2018. The MV-6 OMNI 3D AOI
machine is configured with MIRTEC’s exclusive OMNI-VI- SION® 3D inspection technolo- gy which combines 15 MP CoaXPress camera technology with MIRTEC’s digital multi- frequency quad moiré 3D sys- tem in a cost-effective plat- form. The 15 MP CoaXPress vision system is a proprietary camera system designed and manufactured by MIRTEC for use with the company’s complete product range of 3D inspection systems.
MIRTEC’s digital multi-frequen- cy quad moiré technology is designed
MV-6 OMNI 3D AOI system.
Solving Your Board to Board Connector Design
Challenges
to provide true 3D inspection using a total of four programmable digital moiré projectors. The machine yields precise height measurement data used to detect lifted component and lifted lead defects, as well as solder volume post reflow. Fully configured, the MV- 6 OMNI machines have four 10 MP side-view cameras in addition to the 15 MP top-down camera. MIRTEC is also offering an MV-
6 OMNI configured with a prototype of its OMNI-VISION 2.0® 3D inspection technology. This revolutionary 3D technology combines the company’s proprietary 15 MP top-down CoaX- Press camera with a total of eight dig- ital multi-frequency moiré 3D projec- tors. Each projector is capable of pro- jecting three frequencies with the abil- ity to capture up to 96 3D images per inspection frame. Fully configured, the system includes four 18 MP side-view cameras, in addition to the 15 MP CoaXPress top-down camera. MIRTEC’s MS-11e 3D SPI ma-
chine is configured with an exclusive 15 MP CoaXPress camera system, providing enhanced image quality, accuracy and fast inspection rates. The MS-11e uses dual-projec-
1.0mm Pitch SMT Connector
tion shadow-free moiré phase shift imaging technology to inspect solder paste depositions on PCBs post- screen-print for insufficient solder, excessive solder, shape deformity, shift of deposition, and bridging. The MS-11e uses the same robust plat- form as the MV-6 OMNI Series. The MV-3 OMNI desktop 3D
AOI machine is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION 3D inspection systems providing 100 per- cent compatibility across the compa- ny’s entire 3D AOI product line. These systems contain OMNI-VISION 3D inspection technology which combines 15 MP CoaXPress camera systems with the digital multi-frequency quad moiré 3D system in a newly designed desktop platform. Fully configured, the new MIRTEC MV-3 OMNI ma- chine has four 10 MP side-view cam- eras in addition to the 15 MP CoaX- Press top-down camera. MIRTEC’s total quality man-
800.424.9850 401.823.5200
www.advanced.com info@advanced.com Made in USA
agement system software, INTEL- LISYS®, will also be on display at the IPC APEX EXPO. This software suite promotes continuous process improvement by allowing manufac- turers to track and eliminate defects
on inspected assemblies. Contact: MIRTEC Corp.,
3 Morse Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322
E-mail:
bdamico@mindspring.com Web:
www.mirtec.com
See at IPC APEX, Booth 1327 1 3/7/17 1:00 PM
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