March, 2018
www.us-tech.com
Research Triangle Park, NC — The 14th annual Device Packaging Conference (DPC) 2018 is planned for March 5 to 8, at the We-Ko-Pa Resort and Conference Center in Fountain Hills, Arizona. This international event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This conference is a major forum to exchange knowledge and
BIOMED... Continued from previous page
Group tours will be organized that will highlight key themes in the industry. Center stage is the hub for show
events each day. Visitors can expand their industry knowledge through free presentations, speed network- ing, demos, and expert panel discus- sions. Speed networking events are fast, one-on-one, topic-specific ses- sions that connect participants with other medtech professionals for five minutes at a time. From wearables and virtual real-
ity (VR) to connectivity and automa- tion on the factory floor, sensors are driving advances in design and manu- facturing. A dedicated area of the expo floor will showcase how sensors are being used in a variety of new ways. Visitors can learn from sensor-focused tours, activities, demonstrations, and conference sessions. Design & Manufacturing New
England and Embedded Systems Conference (ESC) are also scheduled to be colocated with BIOMEDevice. Design & Manufacturing highlights the latest innovations in design soft- ware, motion control components, rapid prototyping, 3D printing, and much more. ESC will offer four edu- cational tracks on embedded hard- ware, embedded software, connected devices and the Internet of Things (IoT), and advanced technologies. These three shows combine to offer a full spectrum of products and servic- es that support New England’s boom- ing medtech, embedded systems and design engineering sectors. Contact: UBM, 2901 28th
Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmwest.mddionline.com r
NEPCON... Continued from previous page
Machine vision technology is one area of focus. Several trends are put- ting higher demands on vision tech- nology, including denser BGAs with finer pitches and an increase in sol- der joints per device. Also, the cur- rent smartphone trend of metal cases and large screens is causing manu- facturers to take extra precautions during manufacturing not to scratch or damage the products before they are shipped. A third pavilion, which show-
cases electronic materials, is intend- ed to provide a business platform for materials enterprises to communi- cate with the research and develop- ment and design personnel of device manufacturing companies. Contact: Reed Exhibitions
(Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconchina.com r
SUCCEED AT THE
OFTECHNOLOGY GET UP TO SPEED WITH INDUSTRY-LEADING EDUCATION
Technology shifts fast—go in new directions with the IPC APEX EXPO 2018 education program, featuring timely topics shared by industry peers, experts, and visionaries.
>> Explore the challenges to developing reliable products. >> Leverage new research on materials and processes to develop fresh approaches.
>> Learn more about trending materials, applications and processes such as wearables/printed electronics and jetting/dispensing.
>> Leave with applicable information from industry insiders for success today and tomorrow! VISIT
IPCAPEXEXPO.ORG FOR MORE INFORMATION
Our Keynote Speaker Will Accelerate Inspiration
Jared Cohen, founder and director of Google Ideas at Google and now CEO of Jigsaw (its successor arm with Alphabet Inc.). Game Changers: Technology and the Next Big Disruptions
SAN DIEGO CONVENTION CENTER
CALIFORNIA > USA
provide numerous technical, social and networking opportunities for attendees to meet leading experts from industry and academia. The conference attracts a diverse group of people and provides an opportuni- ty for educational interactions across many different functional groups and experience levels. This year’s keynote speakers
include Phil Garrou, of Microelec ronic Consultants of NC, presenting “3D- IC: Past, Present and Future,” Dr. Raja Swaminathan, of Intel, who will discuss 2D to 3D package architec- tures, and Glenn G. Daves, of NXP Semiconductors N.V., who will pres- ent on the topic of packaging and the
autonomous car. Rozalia Beica, of DOW Electronic Materials, will give a keynote presentation titled “The Growth of Heterogeneous Integration and the Importance of Electronic Materials,” and Nozad Karim, of Amkor Technology, will discuss sys- tem design transition from PCB to system-in-package (SiP). Three conference tracks will be
available: “Interposers, 3D IC and Packaging,” “Fan-Out Wafer-Level Packaging and Flip Chip,” and “Engineered Microsystems/Devices, including MEMS and Sensors.” The three-day technical program will be facilitated by more than 60 conference speakers across the three tracks.
Page 133
IMAPS Annual Device Packaging Conference— March 5-8 The conference will include 13
professional development courses (PDCs) for those who wish to broad- en their knowledge of device packag- ing. These courses can be registered for separately from the full confer- ence. A variety of activities will be available over the course of the con- ference, including welcome and exhibit receptions, an evening panel, an interactive poster sessions, and a golf invitational. Contact: IMAPS, P.O. Box
110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail:
modonoghue@imaps.org Web:
www.imaps.org r
MEETINGS & COURSES FEBRUARY 24 – MARCH 1
CONFERENCE & EXHIBITION FEBRUARY 27 – MARCH 1
IPCAPEXEXPO.ORG #IPCAPEXEXPO
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