Page 88
www.us-tech.com
Los Angeles Office:
Atlanta Office:
Key Specifications:
•Reduced inspection programming times using Gerber data
•Geographical checks for component locations and profiles
•Reverse net generation allows addition of component connectivity info
•Organized component libraries output to Hioki 1240
March, 2018
JTAG Visualizer Adds Features for Faster Debugging
Easton, MD — The latest version of JTAG Technologies’ Visualizer graphical viewing software has been updated, allowing users to assess fault coverage data and pinpoint test faults more easily.
With its wide range of CAD (EDA) tool import filters, Visualizer is an excellent choice for professional boundary scan development and test engineers. Users can import schematic data directly from Mentor (Pads, DxDesig- ner, Capture) Cadence, Altium, and Zuken tools, as well as board layout information in ODB++ and many other ven- dor-specific formats.
Key Specifications: •Capable of fine-pitch inspection at 0.2 mm
•Four-terminal resistance measurement between IC leads and pad to detect insufficient solder
•Soft landing feature to prevent board damage
•Supplementary AOI functions including component presence polarity and displacement
•Test resistors, capacitors, diodes, zener diodes, coils, transistors, digital transistors and photocouplers
•Optional CAD conversions •User-friendly Windows operation -friendly Windows operation
Introduced in this ver- sion of Visualizer, the new “Maps” feature offers a basic test-accessibility view with a simple click of a mouse. The view can easily be fine-tuned by adding a few key component descriptions to a look- up table. Using customizable colors to indicate test coverage levels or access type, a color-coded schematic can be displayed or printed. Once the design has been opti- mized for boundary scan test cover- age and committed to layout, final application development can begin in the JTAG ProVision developer tool. A new “visualize on (test) fail” feature can be used to view all failing circuit nets on the schematic view, layout view or both, automatically. This feature is suitable for small- scale production systems, where the test operator is also responsible for fault diagnosis and rework. The “locate next” feature allows the user to track the course of a net connection through the layers of a PCB layout or the sheets of a schematic. Users can now define multiple color themes for distinguishing differ- ent net classifications, such as for fault
coverage in schematics or fault nets in layouts, to aid in debug and repair. With the new “view through layers” feature, a highlighted fault net can now be viewed along its entire path and as it changes course through the PCB’s layers.
Also, notes can now be added anywhere at a fixed position on the
JTAG Visualizer graphical viewing tool.
schematic or layout. This can convey additional information about test processes or pass design details back and forth between different users. Customers can now combine their JTAG Technologies boundary scan tools with existing automatic test equipment (ATE). JTAG works with any vendor of in-circuit testers (ICT), flying probes (FPT) or func- tional testers (FT).
ATE integration is completely trouble-free and merely involves adapting execution software to oper- ate in the specific ATE environment. In many cases, JTAG develops dedi- cated, customized versions of the boundary scan controllers or pods. This simplifies mechanical integra- tion and preserves signal integrity. Contact: JTAG Technologies, Inc., 111 N West Street, Suite A, Easton, MD 21601 410-770-4415 fax: 410-770-4774 E-mail:
info@jtag.com Web:
www.jtag.com
See at IPC APEX, Booth 3007
Heraeus and Nihon Handa Develop Sinter Pastes
West Conshohocken, PA — Heraeus Electronics is strengthening its col- laboration with Nihon Handa by con- cluding a cross-license agreement for sinter pastes. Nihon Handa is a glob- al manufacturer of materials and equipment for the electronics indus- try. The cross-license will provide both companies’ clients with access to a wide product portfolio.
Both companies have long- standing expertise in sinter technolo- gies. Sinter pastes are used particu- larly in power electronics modules. The two patent portfolios in combina- tion refer to various aspects that include morphology, metallic particle size or sintering tools. Health aspects and price competitiveness have led Heraeus Electronics and Nihon Handa to use micro-silver powder rather than nanopowder.
Visit us at
www.seikausa.com to see more of our products!
ik See at APEX, Booth 2043
Heraeus is a family-owned com- pany, formed in 1851, with head- quarters in Hanau, Germany. The company’s portfolio ranges from com- ponents to coordinated material sys- tems. These are used in a variety of industries, including steel, electron- ics, chemical, automotive, and telecommunications.
Nihon Handa develops, manu- factures and distributes solder prod-
ucts. The company has subsidiaries in Shanghai, Hong Kong, and Malaysia, with approximately 150 employees. The company developed Dodent conductive adhesives, which
Heraeus has expanded its sinter paste portfolio with Nihon Handa.
have been available since 1990. Nihon Handa’s product lineup has since expanded to include silver-sin- tered materials and thermally con- ductive materials. Contact: Heraeus, Inc., 24 Union Hill Road,
West Conshohocken, PA 19428 215-944-9981
E-mail:
jeffery.oddo@heraeus.com Web:
www.heraeus-electronics.com
See at IPC APEX, Booth 1713
NEW
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136
