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www.us-tech.com
March, 2018
TRI Intros Depth from Focus 3D AOI
San Jose, CA — Test Research, Inc., (TRI) is now offering a new lineup of 3D SPI, 3D AOI, 3D planar CT AXI, and ICT solutions. The company has also developed its DFF (depth from focus) algorithm, which is a 3D sens- ing technique that searches for the optimal focus position and measures the depth of the image. The DFF algo- rithm creates a 3D model of the inspected component and its sur- roundings. TRI’s cutting-edge TR7700Q
DFF 3D AOI guarantees 0.04 mil (1 µm) ultra-high resolution and inspects chips down to 01005 (0402 metric) in size. The company’s DFF module and stop-and-go technology are designed to optimize the inspec- tion of complex PCBs, delivering high speed, accuracy and reliability. Planar computed tomography
(CT) X-ray effectively inspects PCBs layer-by-layer in a noninvasive way achieving excellent inspection depth. The technology is recommended for the inspection of solder volume, dou- ble-sided, multilayer boards and defects, such as head-in-pillow.
The company is also offering its
TR7007QI 3D SPI, along with the 2D and 3D TR7500QE AOI solution. Both systems include CoaXPress imaging
TR7700Q 3D AOI system.
technology. Also available is the com- pany’s hallmark TR7600 SIII series CT AXI, including the TR7600 SIII and TR7600F3D. The TR76000 SIII series is designed to deliver clear 3D X-ray images using high-speed cam-
eras with advanced image processing. Contact: Test Research USA,
Inc., 832 Jury Court, Suite 4, San Jose, CA 95112 % 408-567- 9898 E-mail:
triusa@tri.com.tw Web:
www.tri.com.tw
See at IPC APEX, Booth 1317
SHENMAO Tackles Tough Solder Paste Challenges
See at APEX, Booth 1613
San Jose, CA — SHENMAO Amer - ica’s new PF606-P140/PF606-P245 lead-free, halogen-free solder pastes are designed to eliminate head-in-pil- low (HiP) defects, voids, slumping, non-wetting opens, and short stencil lifecycles. The PF606-P140/PF606-P245
pastes were developed to improve ICT testability by completely removing flux to prevent contamination of test pins during test operation. Minimal flux residue gathers near the outside of the solder joint on the PCB sub- strate — a substantial improvement over legacy solder paste. With continu- ous high-speed printability, the pastes produce first-rate solder paste print quality and a wide reflow process win- dow for excellent solderability. SHENMAO has successfully
been approved by many international well-known electronic manufacturers. The company strives to offer the best quality, without compromising cost and time-to-market, while providing maximum value to its customers. SHENMAO develops and manufac-
tures SMT solder paste, laser solder- ing paste, cored solder wire, wave sol- der bar, semiconductor packaging sol- der spheres, wafer bumping solder
Lead-free solder paste.
paste, flux, and solar PV ribbon. The company blends SMT sol-
der paste at its facility in San Jose, California, for distribution in North America.
Contact: SHENMAO America,
Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477 E-mail:
usa@shenmao.com Web:
www.shenmao.com
See at IPC APEX, Booth 2344
In-Line Vapor Phase Systems from R&D VaporTech
Burnsville, MN — R&D VaporTech, a subsidiary of IBL Technologies, LLC, is now offering its Smartphase in-line vapor phase reflow systems. The Smartphase is designed for high- volume manufacturing. The fully automatic, in-line
vapor phase reflow oven is designed specifically to integrate easily into any manufacturing line. It is a true in-line vapor phase reflow oven with an edge-guided conveyor system for easy handling and left-to-right man- ufacturing reflow. The Smartphase offers a 17.7 x
See at APEX, Booth 1701
15 in. (45 x 38 cm) working envelope. At 13.5 ft (4.1m), the system reduces floor space requirements. It includes a SMEMA upstream/downstream
interface, barcode capability and all of the company’s standard features. The Smartphase reflow system
offers a high degree of reflow profile control, 250 recipe storage and is excellent for high-volume, automated in-line vapor phase processing. The reflow oven offers adjustable edge guide conveyors, a four-zone convec- tion preheat section, vapor preheat function, fully saturated vapor phase reflow, horizontal reflow position,
and left-to-right product flow. Contact: R&D VaporTech, 11300
Rupp Drive, Suite 2012, Burnsville, MN 55337 % 952-217-4407 E-mail:
sabine@rdvaportech.com Web:
www.rdvaportech.com
See at IPC APEX, Booth 3107
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