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www.us-tech.com
May, 2018
EAO Creates Tailored HMI Solution for KOR Engineering
By John J. Pannone, VP Sales — HMI Systems, EAO Corporation
OR Engineering approached EAO Cor- poration with a simple components order for a new control panel designed for new label- ing and packaging machinery. EAO quickly learned that the request was to fulfill an original need of individual controls for panels located in several operational areas of the equipment. After further input about the design engi- neering specifics, EAO realized that there was no particular direction or plan for what KOR Engineering desired the end product to look like. The company simply wanted an updated appear- ance, while maintaining the use of rugged controls. Environment plays a crucial role in the
K
KOR inspection slitter rewinder for digitally printed films.
design process and eventual implementation of human machine interface (HMI) systems and com- ponents. Because KOR’s new machines are used in the label printing industry, equipment is often located in harsh environments and subjected to harsh chemicals, oils and cleaning agents. This presented an opportunity for EAO’s design and engineering team to provide a more complete solution that incorporated an HMI sys- tem able to withstand the specific environments KOR’s machines were exposed to, instead of a basic component order.
Rugged HMI System Design t Printed Circuit Board Protection OPENING OUR SECOND LOCATION IN BILLERICA,MA 1ST QTR 2018.
Rather than using a standard process of panel marking, such as engraving, printing or silk screening, EAO’s designers created a full HMI solution that was rugged enough to withstand the harsh environments of the customer. The company used a “metal photo” finish process on the aluminum panel substrate that was durable enough to operate in produc- tion and provided a clean, sophisti- cated look for the finished product. The metal photo process uses an acid etchant to create high-quality images, graphics or text on metal plates that can be subjected to extreme conditions. EAO’s team also assisted KOR Engineering with establishing which components would be best suit- ed for the operational environment. EAO presented its Series 04 product line, which has an IP65 oil and water rating. Each panel was also outfitted with a Series 84 certified e-stop to con- form to strict ISO standards. Instead of simply fulfilling the original order request, EAO consid-
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Certifications ISO 9001:2015 AS 9100D ITAR ESD S20.20 Nadcap Mid 2018 Cage Code 3VCY8 JobBOSS ERP Sys. Veteran Owned Minority Owned
Services Provided Conformal Coating Potting/Encapsulation PCB Cleaning Ionic Testing Plasma Treating Coating Removal Soldering AOI Blacklight Insp. UV curing
Industries Served Military Aerospace Space
Automotive Medical Utilities Solar Energy Traffic Management
TopLine Gets Test Wafers from GM Components
42680 Christy St., Fremont, CA 15102268700
www.speccoat.com
16 Esquire Road, Billerica,MA 1 9783620346
Irvine, CA — TopLine has completed its acquisition of daisy chain flip chip test wafers from General Motors Components Holdings, LLC, (GMCH). Daisy chain components are essential for evaluation and developmental applications that include placement and solder practice, as well as under- fill experiments and lifecycle testing. The deal included a series of thermal dies that enable Kelvin con- nections to heat up and monitor tem- perature changes, originally devel- oped by Kokomo Semiconductors to characterize packaging technologies. The acquisition includes more than 1,200 finished daisy chain wafers ranging in pitch from 4 to 10 mil (102 to 254 μm), I/O ranges from 88 to 9,100 bumps, and die sizes from 0.2 to 1 in. (5 to 25 mm) square. Pad patterns include perimeters and full- arrays. Test components without sol- der bumps can be used for wirebond- ing practice and certification. Contact: TopLine Corp., 95 Highway 22 W., Milledgeville, GA 31061 800-776-9888 E-mail:
sales@topline.tv Web:
www.topline.tv
See at NEPCON China, Booth 1A21
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