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www.us-tech.com
May, 2018
Nordson DAGE Launches Paragon Materials
Carlsbad, CA — Nordson DAGE has launched its Paragon™ Materials, a new suite of software designed for performing mechanical failure analy- sis on a range of micro-materi- als.
Demands on product life- 18" ht.
Size does matter! SURFACE MOUNT AND PLUG IN
MILITARY/CRITICAL APPLICATIONS QPL UNITS STANDARD
• Audio Transformers • Pulse Transformers • DC-DC Converters • Transformers • MultiPlex Data Bus Transformers • Power & EMI Inductors
TRANSFORMERS & INDUCTORS VISIT OUR EXCITING NEW WEBSITE with SEARCH WIZARD
143 Sparks Ave. Pelham, N.Y. 10803
info@picoelectronics.com
www.picoelectronics.com
time are as critical as ever. New device evaluation must assess both long-term fatigue and cyclical performance. Adding to this complexity is the fact that failure can come from many different sources, includ- ing individual interconnects, surface components, the sub- strate material, or a combina- tion of these factors. Paragon Materials is
specifically designed to tackle these complex failure modes and take the operator straight to the root cause of the failure. Traditionally, micro-materials testing has been difficult to set up and even more taxing to ex- tract the correct failure infor- mation from the raw data. Paragon Materials presents a clear interface to the user with built-in analysis tools and sta- tistical algorithms. The software suite is fo-
cused on the mechanical test- ing and data analysis of mate- rials used in the packaging of complex electrical devices. Bond testing typically evaluates the in- tegrity of interconnects associated with dice and integrated circuits, essentially their connection to the
Nordson DAGE is now offering micro-materials failure analysis.
Contact: Nordson DAGE, 2747
Loker Avenue West, Carlsbad, CA 92010 % 760-930-3307 E-mail:
sales@nordsondage.com Web:
www.nordson.com
outside world. Micro-materials test- ing, however, concentrates on eval- uating the strength of the die and package itself.
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