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Page 54


www.us-tech.com


May, 2018


Nordson DAGE Launches Paragon Materials


Carlsbad, CA — Nordson DAGE has launched its Paragon™ Materials, a new suite of software designed for performing mechanical failure analy- sis on a range of micro-materi- als.


Demands on product life- 18" ht.


Size does matter! SURFACE MOUNT AND PLUG IN


MILITARY/CRITICAL APPLICATIONS QPL UNITS STANDARD


• Audio Transformers • Pulse Transformers • DC-DC Converters • Transformers • MultiPlex Data Bus Transformers • Power & EMI Inductors


TRANSFORMERS & INDUCTORS VISIT OUR EXCITING NEW WEBSITE with SEARCH WIZARD  


143 Sparks Ave. Pelham, N.Y. 10803 info@picoelectronics.com


www.picoelectronics.com


time are as critical as ever. New device evaluation must assess both long-term fatigue and cyclical performance. Adding to this complexity is the fact that failure can come from many different sources, includ- ing individual interconnects, surface components, the sub- strate material, or a combina- tion of these factors. Paragon Materials is


specifically designed to tackle these complex failure modes and take the operator straight to the root cause of the failure. Traditionally, micro-materials testing has been difficult to set up and even more taxing to ex- tract the correct failure infor- mation from the raw data. Paragon Materials presents a clear interface to the user with built-in analysis tools and sta- tistical algorithms. The software suite is fo-


cused on the mechanical test- ing and data analysis of mate- rials used in the packaging of complex electrical devices. Bond testing typically evaluates the in- tegrity of interconnects associated with dice and integrated circuits, essentially their connection to the


     


Nordson DAGE is now offering micro-materials failure analysis.


Contact: Nordson DAGE, 2747


Loker Avenue West, Carlsbad, CA 92010 % 760-930-3307 E-mail: sales@nordsondage.com Web: www.nordson.com


 


outside world. Micro-materials test- ing, however, concentrates on eval- uating the strength of the die and package itself.


  


  


 


 


  


 


 


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