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hi-TeCh evenTS
www.us-tech.com
SMT Hybrid Packaging Offers Overview of Microelectronics Industry
Stuttgart, Germany — Scheduled to be held from June 5 to 7, 2018, in Nuremberg, Germany, SMT Hybrid Packaging will invite visitors to see the entire range of technical process- es in electronics production, from concept to completion. Numerous new exhibitors and
key players in the industry will offer a broad overview of the entire value chain, presenting new products and highlighting trends and develop- ments. Recently Mesago Messe Frankfurt, the organizer of the event, reported that the number of exhibiting companies is larger than last year. This year, a “newcomer pavil-
ion” offers cost-effective pricing and a full-service package for companies that wish to exhibit at the trade show without much organizational effort. There are also other joint booths planned, such as “Mixed Double — PCB Meets Component” and “EMS Intersection.” The mixed PCB and components booth will display circuit boards, modules and materials, while the EMS booth is a joint platform for contract manufacturers. Optoelec - tronics products and solutions will be on display at the nearby “Optics Meets Electronics” booth. On June 6, a range of tutorials in English will be given. Sessions
KYZEN’s Dr. Bixenman to Present at Harsh
Environments Conference
Nashville, TN — KYZEN’s Mike Bixenman, DBA, will present at the SMTA Electronics in Harsh Environ - ments Conference, April 24 to 26, 2018, at the Crowne Plaza Amsterdam, Netherlands. The conference is focused on
building reliable electronics that operate within harsh environments. Dr. Bixenman will present “Mater - ials Characterization Under Lead - less Component Bodies” and will dis- cuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine
the risk of failure. “This conference is a great
resource for engineers of all levels,” explains Dr. Bixenman. “Materials in electronics packaging continue to evolve in response to complex manu- facturing and reliability require- ments, particularly those that must work within aggressive operating environments.” Experts from industry and aca-
demia will present on predicting component life, solder alloys that can withstand high operating tempera- tures, test methods for harsh envi- ronments, electrochemical reliability
Continued on next page 2018 EDITOrIAL AND ISSUE Jan/Feb March EDITORIAL
Test & Measurement Electronics West/MDM PP
Assembly & Production APEX PP
April/May SMT & Assembly Nepcon China PP
Wire Processing Tech PP EDS PP
June July August
Test & Automation SMT/Hybrid/PKG PP ATX East /MDM PP
Production & Packaging Semicon West/Intersolar PP
PCB & Assembly Nepcon South China PP
September Test & Automation SMTAI PP
October Nov/Dec
Components & Distribution electronica PP
PP= Product Preview
Test & Measurement E
TrADESHOW CALENDAr SHOW
DATE DesignCon ATX/ Electronics West/MDM
APEX APEC
Advanced Design & Mfg Expo
BIOMEDevice Boston/ESC Nepcon China
Wire Processing Tech EDS
SMT/Hybrid/PKG ATX East /MDM
SEMICON West/Intersolar
Nepcon South China PCB West Autotestcon
IMAPS SMTAI
The Assembly Show MDM Minneapolis
FABTECH electronica ATX Montreal
BIOMEDevice, ESC
Jan. 30-Feb. 1 Feb. 6-8
Feb. 27-March 1 March 6-8 March 7-8
April 18-19 April 24-26 May 9-10 May 15-18
June 5-7 June 12-14
July 10-12
Aug. 28-30 Sept. 11-13 Sept. 18-20
Oct. 9-11 Oct. 17-18 Oct. 23-25 Oct. 31-Nov. 1
Nov. 6-8 Nov. 13-16 Nov. 14-15
Dec. 5-6 F
LOCATION
Santa Clara, CA Anaheim, CA
San Diego, CA San Antonio, TX Cleveland, OH Boston, MA
Shanghai, China Milwaukee, WI Las Vegas, NV
Nuremberg, Germany New York, NY
San Francisco, CA
Shenzhen, China Santa Clara, CA National Harbor, MD
Pasadena, CA Rosemont, IL Rosemont, IL Minneapolis, MN
Atlanta, GA
Munich, Germany Montreal, Quebec
San Jose, CA A
include “Comparative Assessment of Temperature Mission Profiles or Component Qualification” and “Preventing SMT Assembly Defects and Product Failure.” The central topics at the trade
show include interconnection tech- nology, reliability and quality of
assemblies, microsystem technology, system integration, and automation. Contact:Mesago Messe
Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711- 61946-91 E-mail:
smt@mesago.com Web:
www.smthybridpackaging.com r
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
April 18-19, 2018, Design & Manufacturing New England. *Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.design-manufacturing-new-england.designnews.com
April 18-19, 2018, BIOMEDevice Boston. *Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.design-manufacturing-new-england.designnews.com
April 24-26, 2018, NEPCON China. *Shanghai World EXPO Exhibition & Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconchina.com
April 24-26, 2018, SMTA Electronics in Harsh Materials Conference.*Crowne Plaza Amsterdam —Schiphol. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
http://www.smta.org
May 8-10, 2018, SEMICON Southeast Asia. * Malaysia International Trade & Exhibition Centre (MITEC). Contact: SEMI, 673 S Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-428-9600 E-mail:
semihq@semi.org Web:
www.semiconchina.org
May 9-10, 2018, EWPTE. *Wisconsin Center, Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 E-mail:
cheryl@epishows.com Web:
www.epishows.com
May 15-18, 2018, EDS. *The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111 Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282 E-mail:
eds@edsconnects.com Web:
www.edsconnects.com
June 5-7, 2018, SMT/Hybrid/Packaging. *Nuremberg Exhibition Centre, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178 Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91 E-mail:
smt@mesago.com Web:
www.smthybridpackaging.com
June 19-22, 2018, automatica. * Munich Expo Fairgrounds, Munich, Germany. Contact: Messe München GmbH, Messegelande, 81823 Munich, Germany % +49-89-949-20720 fax: +49-89-949-20729 E-mail:
info@messe-muenchen.de Web:
www.automatica-munich.com
June 12-14, 2018, MD&M East. *Jacob K. Javits Convention Center, New York, NY. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmeast.mddionline.com
June 10-15, 2018 IEEE/MTT-S International Microwave Symposium*Pennsylvania Convention Center, Philadelphia, PA. Contact: IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016 % 732-562-3878 E-mail:
ieee-mce@ieee.org Web:
www.ims2018.org
July 10-12, 2018, SEMICON West.*Moscone Center, San Francisco, CA. Contact: SEMI, 673 S Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-428-9600 E-mail:
semihq@semi.org Web:
www.semiconwest.org
August 28-30, 2018, NEPCON South China.*Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconsouthchina.com
September 11-13, 2018, PCB West. * Santa Clara Convention Center, Santa Clara, CA. Contact: UP Media Group, Inc., P.O. Box 470, Canton, GA 30169 % 678-234-9859 Web:
www.pcbwest.com
September 17-20, 2018, IEEE AUTOTESTCON.*Gaylord National Convention Center, National Harbor, MD. Contact: IEEE, 3 Park Avenue, 17th Floor, New York, NY 10016 % 732-562-3878 E-mail:
ieee-mce@ieee.org Web:
www.autotestcon.com
October 8-10, 2018, IMAPS. * Pasadena Convention Center, Pasadena, CA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail:
modonoghue@imaps.org Web:
www.imaps.org
October 14-18, 2018, SMTA International. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
October 23-25, 2018, The ASSEMBLY Show. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: BNP Media, 2401 W Big Beaver Road, Suite 700, Troy, MI 48084 % 248-362-3700 E-mail:
amy@theassemblyshow.com Web:
www.theassemblyshow.com
May, 2018
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