May, 2018


www.us-tech.com


Delaware, OH — Engineered Material Systems (EMS) has debuted its DA- 6010, a non-conductive die attach ad- hesive designed for image sensor at- tach or chip-on-board applications.


SEHO and Toratec Demo Selective Soldering System


Erlanger, KY — SEHO Systems is demonstrating its SelectLine-C mod- ular selective soldering system along with its partner Toratec Shanghai at NEPCON China. The SelectLine-C’s modular design allows the integra- tion of various processes, such as se- lective brushing for automatic clean- ing or AOI for solder joint inspection. The company’s Synchro soft-


ware allows users to double produc- tion volume without major invest- ment and ultrasonic nozzle cleaning increases machine availability, as well as lengthens nozzle service life. With hundreds of machine in-


stallations throughout the entire range of products, China represents an important market for SEHO. The


EMS Introduces Nonconductive Die Attach Adhesive


EMS DA-6010 has a moderate glass transition temperature (Tg) and


modulus. With an optimized rheology for needle dispensing by time-pres-


Page 57


sure, auger or positive displacement, DA-6010 is formulated to adhere to both flexible and rigid substrates. DA-6010 is the latest addition


to EMS’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, and pho-


tonics applications. Contact: Engineered Material


Systems, Inc., 100 Innovation Court,


Delaware, OH 43015 % 740-362-4433 E-mail: mfrancis@emsadhesives.com Web: www.emsadhesives.com


DA-6010 nonconductive die attach adhesive.


Introducing the new MYPro series


THE FUTURE IS ALREADY HERE.


SelectLine-C modular selective soldering system.


company’s customers benefit from complete solutions designed to make production more efficient. This in- cludes full, on-site service and sup- port, along with process optimization after sales. The company works with


Toratec to provide technical support and service in China. The company’s staff is trained at SEHO’s headquar-


ters in Germany on a regular basis. Contact: SEHO North America,


Inc., 1420 Jamike Drive, Suite 300, Erlanger, KY 41018 % 859-371-7346 E-mail: sehona@sehona.com Web: www.sehona.com


See at NEPCON China, Booth 1B25


Meet us


Lost your news item


of interest? Find it once again at www.us-tech.com


at booth # 1G25 at


NEPCON China 2018


The new MYPro series – the perfect fi t for any intelligent factory The future of high-mix production belongs to those who can mount any component on any board. Handle any batch or series with zero changeover times. And jet solder paste and adhesive deposits with high-precision at record speeds. The new MYPro series combines two of the industry’s most productive platforms – the MY300 and MY700 – giving you more capabilities than ever before within a 40% smaller footprint than previous generations. Simply put, it’s the smartest way to boost quality and utilization across a vast range of challenging applications.


Whatever your ambitions, the future is already here. In fact, it’s just in time.


IS YOUR FACTORY PREPARED?


See at NEPCON China, Booth 1G25 and at SMT Hybrid Pkg., Booth 4-349


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