May, 2018 Continued from previous page


High-Speed 3D AOI Nordson YESTECH’s 3D imaging technology


provides EDM with high-speed PCB inspection and strong defect coverage. With one top-down viewing camera, four side-viewing cameras and both 2D and 3D inspection, the FX-940 ULTRA in- spects solder joints and verifies correct part assem- bly, enabling users to improve quality and increase throughput. Programming the FX-940 ULTRA is fast and intuitive. Typically, it takes operators less than 30 min-


utes to create a complete inspection program, in- cluding solder and lead inspections. The system uses a standard package library to simplify train- ing and ensure program portability across manu- facturing lines. Advanced LED lighting and image processing technology integrates several tech- niques, such as 3D inspection, color inspection, normalized correlation, and rule-based algorithms, to provide complete inspection coverage with a low false failure rate. Not only did the installation go


smoothly, but McAden adds that Nordson YESTECH’s customer serv- ice has always been excellent, which was another factor in EDM’s choice of returning to the company for this next level of inspection. According to McAden, David Cobb, Nordson YESTECH’s trainer, was superb at describing all available inspection op- tions. Additionally, he says that


IMDES Intros Low-Cost Vapor Phase Soldering


System Bad Bentheim, Germany — IMDES Creative Solutions has launched its CONDENS-IT PROFILER range of low-cost, lab-sized, vapor phase re- flow soldering machines. The compa- ny also offers starter kits that in- clude the CONDENS-IT MINI PRO- FILER, lead-free solder paste and Galden® heat-transfer fluid, along with instructional materials.


www.us-tech.com


Page 19 EDM Partners with Nordson YESTECH for 3D AOI


Nordson YESTECH’s expert use of remote soft- ware tools allows for quick resolution of specific in- spection challenges, providing the company with extra value after the sale.


Next Phase of Partnership McAden emphasizes that EDM has relied on


Nordson YESTECH AOI for many years. “Our ex- isting YESTECH equipment still works fine for 2D inspections, but the ULTRA machine provides many added inspection capabilities. Ultimately, we chose YESTECH again because of proven relia- bility, ease of programming and excellent customer support.”


Those same qualities are what help make


EDM successful. As a U.S.-based electronics con- tract manufacturer, its PCB assemblies consis- tently meet, and exceed, customers’ expectations


for quality, price and delivery. This is part of what differentiates the company and makes it more than a PCB vendor. EDM provides a highly skilled, flexible and experienced design team that is com- mitted to customers’ growth and success. By partnering with Nordson YESTECH,


EDM is able to provide customers with high-quali- ty 3D AOI capabilities and to continue fulfilling its mission of delivering superior PCB assemblies to every company that it works with. Contact: Electronic Design and Manufactur-


ing, Inc., 31 Millrace Drive, Lynchburg, VA 24502 % 434-385-0046 E-mail: rtaylor@edmva.com Web: www.edmva.com and Nordson YESTECH, 2747 Loker Avenue West, Carlsbad, CA 92010 % 760-918-8471 E-mail: sales@nordsonyestech.com Web: www.nordsonyestech.com r


CONDENS-IT thermal profiler. The range of vapor phase reflow


systems includes three models, MI- NI, JUMBO and DINO. They are es- pecially useful for small-scale PCB development, individual pieces, pro- totypes, or very low-volume series. The machines are designed to handle prototype PCBs that use BGAs and LGAs, as well as stacked arrays. Vapor phase soldering, also


known as condensation soldering, us- es the condensation of a heat transfer fluid to heat the board, which is then reflowed. The technique is being re- vived as today’s heat transfer fluids are not as harmful as those used in the past.


Contact: IMDES Creative


Solutions, Schulstrasse 21, D-48455 Bad Bentheim, Germany % +49-0-5924-997337 fax: +49-0-5924-997338 E-mail: m.van.stralen@imdes.de Web: www.imdes.de


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