May, 2018
www.us-tech.com
Redmond, WA — Data I/O Corporation will be showcasing universal flash storage (UFS) device programming technology on its Lumen™X platform at NEPCON China 2018. New requirements for faster perform- ance, improved responsiveness and grow- ing file sizes for Internet of Things (IoT) devices, the connected vehicle and wireless applications are driving the transition from eMMC flash to UFS.
The LumenX programming platform is built to support the latest device tech- nologies for maximum performance today and in the future.
Data I/O’s UFS support delivers excel- lent programming performance, capacity and manageability to meet high-volume production demands, while delivering a
Indium
Highlights Gold Alloy Solder Preforms
Clinton, NY — Indium Corporation is now offering its precision gold alloy solder preforms. Depending on the alloy, gold-based solders have a melt- ing point that ranges from 536 to 1,947.2°F (280 to 1,064°C), making it compatible with subsequent reflow processes. Gold-based solders are resistant to corrosion, provide supe-
PSV7000 automated programming system with LumenX. low total cost of ownership.
UFS support is available on the LumenX desktop or integrated into the PSV5000 and PSV7000 automated pro- gramming systems. Existing PSV customers can protect their investments and easily upgrade their PSV systems to support UFS as production requirements change. The combination of LumenX programming tech- nology in a PSV system delivers maximum performance, flexibility and throughput at the lowest total cost. Contact: Data I/O Corp., 6464 185th Avenue NE, Suite 101, Redmond, WA 98052 425-867-6922 E-mail:
higginj@dataio.com Web:
www.dataio.com
See at NEPCON China, Booth 1A32
Page 87 Data I/O Showcases UFS Programming Technology
AuSn solder preforms.
rior thermal fatigue resistance and exhibit excellent joint strength. Indium’s AuSn preforms have a high tensile strength, ensuring high- reliability for joining and sealing. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical. Semiconductor-grade AuSn pre- forms are designed specially to meet the challenges facing RF and power semiconductor devices as they con- tinue to get smaller, with increasing power density and power ratings. The company’s lead-free and RoHS- compliant preforms are available in a variety of standard and custom-engi- neered designs. Contact: Indium Corp., 34 Robinson Road, Clinton, NY 13323 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
See at SPIE Defense and Commercial Sensing Expo, Booth 1714
See at NEPCON China, Booths 1B27 and 1C75
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