May, 2018 Continued from previous page


www.us-tech.com


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Commercially Available, Hands-Free MIC Device Assembly To further guarantee reliability and quality,


tach at much higher speeds. NEO Tech’s achievements also include the


ability to reliably handle large, thin, monolithic mi- crowave integrated circuit (MMIC) devices. Devel- opments include extremely accurate dispense for epoxy and a proprietary die eutectic attach process, using solder preforms. These innovations enable manufacturing of


MMICs with minimum voiding under dice as thin as 0.002 in. (0.05 mm). Originally, NEO Tech devel- oped this system to meet the needs of high-reliabil- ity applications in defense, advanced telecommuni- cations and implantable medical devices. System designers using large, thin, MMIC devices in their high-frequency applications now can work confi- dently with this option for both prototyping and manufacturing at scale. In the past, the industry average for thin die


damage in handling before placement into a higher level assembly has ex- ceeded 20 percent. For odd-shaped and extremely thin dice and ICs, NEO Tech’s fully automatic eutectic die-at- tach process has nearly eliminated re- work. The company’s continuous, con- tiguous automated production line guarantees planar placement of these delicate dice with minimal interface voids. For the notoriously sensitive eutectic die-attach method, the tuned handling and improved process accu- racy represent significant break- throughs in product quality, reliabili- ty and cost.


Truly Hands-Free Increasing overall process con-


sistency by eliminating human error in areas such as epoxy dispense and eutectic attach was the critical first step. Gaining the full economic bene- fit, however, required integrating these and other advancements into an automated line capable of producing high-complexity devices at demanding rates and yields. NEO Tech has accomplished this


with a level of quality and cost-effi- ciency that exceeds existing MIC as- sembly touch methods.


RFMW Offers Support for Aethercomm Amplifier


San Jose, CA —RFMW is now offering design and sales support for a multi- octave bandwidth, GaN, solid state power amplifier from Aethercomm. SSPA 6.0-18.0-30 operates from 6 to 18 GHz and delivers 30 watts (typ.) of saturated output power to the load. Typical small signal gain is 45 to 55 dB while typical power gain is 40 to 45 dB. A PA enable command is used to gate the PA on and off. On time is specified at 40 µs maximum and off time at 10 µs maximum. Standard features include reverse


polarity protection, output short and open circuit protection and over- and under-voltage protection. The power amplifier module is packaged in a rugged housing that can be used in high shock and vibration environ- ments with baseplate temperatures from –40 to +158°F (–40 to +70°C). Contact: RFMW, Ltd.,


188 Martinvale Lane, San Jose, CA 95119 % 408-414-1450 E-mail: info@rfmw.com Web: www.rfmw.com


smt.hanwhatechwin.com See at NEPCON China, Booth 1J40 and at SMT Hybrid Pkg., Booth 4A-318


thorough cleaning is mandatory to prevent latent defects in interface junctions during wirebond in- terconnect. NEO Tech’s automated process in- cludes in-line argon plasma cleaning just prior to wire or ribbon bonding, ensuring complete resid- ual organic removal without exposing the IC to ions or UV. NEO Tech’s hands-free, continuous, contigu-


ous, automatic MIC assembly lines operate in a lean manufacturing environment, with high repeatabili- ty and near-zero rework. High-frequency system de- signers seeking domestic suppliers offering high quality and cost-effective MIC solutions have much to gain from these next-generation capabilities. Contact: NEO Tech, 9340 Owensmouth


Large and thin MIC devices require extreme- ly accurate die attach, dispensing processes and minimal voiding under components.


Avenue, Chatsworth, CA 91311 % 818-495-8617 E-mail: info@neotech.com Web: www.neotech.com r


LED Big Board Solution


Production class assembly equipment for 24”, 28”, 48”, 59” PCB form factors includes high performance printing, precision component mounting, repeatable reflow, and reliable board handling with expert training, service and support.


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