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www.us-tech.com
May, 2018
TDK: High-Sensitivity Mini Transponder Coil
Uniondale, NY — TDK Corporation has introduced its miniaturized TPL - C 553030-592H automotive trans - ponder coil for tire pressure monitor- ing systems (TPMS) that operate at a center frequency of 125 kHz. With its dimensions of 0.22 x 0.12 x 0.12 in. (5.5 x 3 x 3 mm), the new component has a foot- print that is 30 percent smaller than its predecessor. Due to its optimized core
geometry and material, the miniaturized component demon - strates a high sensitivity of nearly 25 mV/µT, which allows TPMS initializa- tion at the same distance as its 0.31 in. (8 mm) predecessor. The new transponder coil has an inductance of 5.89 mH with a minimum Q value of 35 and a maximum DC resistance of
70W. The AEC-Q200-qualified and RoHS-compatible component has a wide operational temperature range of –40 to +258.8°F (–40 to +125°C).
Minaturized automotive transponder coils.
Contact: TDK U.S.A. Corp., 455
RXR Plaza, Uniondale, NY 11556 % 516-535-2600 fax: 516-294-8318 Web:
www.tdk.com
Solving Your Board to Board Connector Design
Challenges
Rehm Creates Database for Solder Void Minimization
Roswell, GA — With its Void Expert database, Rehm is now offering a tool that provides an overview of influ- encing factors and machine interac- tion that can contribute to solder voiding. Voids can be found in most solder joints, the result of trapped gas in the molten solder. When the solder hardens, these gas bubbles are frozen in place. This database makes it easy to understand the mechanisms in-
1.0mm Pitch SMT Connector
Image of typical voids from Rehm’s Void Expert database.
volved in the occurrence of voids and outgassing, and to identify essential influences. Variables and the ways in which they interact are explained clearly with reference to their respec- tive effects. Graphics and Pareto charts
help to clarify the relationships, which can be complex in some cases. This allows the user to draw conclu- sions as to how voids can be mini- mized for certain applications. The reliability of most solder
joints is not necessarily affected by voids, but more sensitive packages, such as LGAs and QFN, require min- imal voiding. The greater the energy dissipation requirements of the sol- der joint, the less voids it can toler- ate. In particular, solder joints in semiconductor devices should be
800.424.9850 401.823.5200
www.advanced.com info@advanced.com Made in USA
See at SMT Hybrid Pkg., Booth 4-141 1 3/7/17 1:00 PM
nearly void-free. Contact: Rehm Thermal Sys-
tems, LLC, 3080 Northfield Place,
Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail:
p.handler@rehm-group.com Web:
www.rehm-group.com
See at NEPCON China, Booth 1F20
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