May, 2018
www.us-tech.com
Page 51 Nihon Superior Intros New SN100CV Solder Alloy
Osage Beach, MO — Nihon Superior Co., Ltd., is introducing its new SN100CV™ P608 D4 solder paste, and showcasing its NS-F851 rosin- based flux, ALUSAC-35 alloy and Al- conano nano-silver paste at NEP- CON China. SN100CV P608 D4 is a halogen-
free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a disper- sion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excel- lent wetting and reduces voiding. The company also plans to ex-
hibit NS-F851, the improved version of the NS-F850 rosin-based flux for lead-free wave soldering. The no- clean flux offers excellent wetting of all PCB and component substrates for through-hole fill, facilitating the solder drainage for minimal bridging and icicle formation. It is particular-
Viscom Machines Support Standardized IoT Data
Duluth, GA —Viscom’s intelligent and cross-linked systems are ready for In- dustry 4.0 applications. The company offers a portfolio of inspection equip- ment, including 3D SPI, 3D AOI, 3D MXI, and 3D AXI. Viscom is also a part of the IPC Connected Factory Ex- change (CFX) initiative. The company’s machines are
able to communicate through the cloud and convey standardized data to other equipment and to operators. Technicians can view real-time sta- tistics on their personal devices, in-
ly suited for lead-free wave soldering. The rosin-based flux ensures that the full reliability potential of SN100C lead-free solder is realized. ALUSAC-35 is a lead-free alloy
designed for soldering aluminum. Despite the cost and the performance advantages of aluminum, its com- mercial adoption has been slow be- cause of the concern about the gal- vanic corrosion that results from dif- ferences in the electrical potential of the constituent phases. Joints to alu- minum made with this new alloy re- tain strength even after 30 days of saltwater immersion. Alconano nano-silver paste is
based on a patented technology that makes it possible to effectively join
SN100CV P608 D4 solder paste.
most metals as well as Si and SiC at low sintering temperatures, if neces-
sary in nitrogen, without the nitrous or sulfurous residues that are the byproducts of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver parti- cles and the consequent strong capil- lary forces make it possible to achieve strong bonds even on copper with high electrical and thermal conductivity at low temperatures, without the need
for external pressure. Contact: Nihon Superior USA, LLC, 1395 Hawk Island Drive,
Osage Beach, MO, 65065 % 573-280-2357 fax: 619-923-2714 Web:
www.nihonsuperior.co.jp/english
See at NEPCON China, Booth 2L31
Components with varying thermal specs to be soldered on the same PCB?
A Viscom technician demos the X7056-11 AXI system.
cluding smartphones and tablets. This information includes unit counts, as well as a live data stream that shows the events occurring on any particular machine in real time. This communication requires nothing proprietary, no middleware, and high- lights CFX as an open standard. Viscom’s Quality Uplink soft-
ware feature enables intelligent link- ing of results between different in- spection gates. Operators then have easy access to all essential data and inspection images. The inspection systems can carry on fully automated communication with placement ma- chines and screen printers and ad-
just their parameters. Contact: Viscom Inc., 1775
Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 E-mail:
info@viscomusa.com Web:
www.viscomusa.com
See at NEPCON China, Booth 1C65
KIC World Headquarters +1 858.673.6050
sales@kicmail.com www.kicthermal.com
KIC International Sales - Europe +39.342.147.9460
europe.sales@
kicmail.com www.kicthermal.com
KIC International Sales - Singapore +65.6744.4998
asia.sales@
kicmail.com www.kicthermal.com
KIC International Sales - China +86.512.6763.5171
asia.sales@
kicmail.com www.kic.cn
See at NEPCON China, Booth 1B58 and at SMT Hybrid Pkg., Booth 4A-230
KIC’s process optimization software: Reflow oven setup in seconds.
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