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www.us-tech.com
May, 2018
Heraeus Adds to Line of Low-Temp Solder Pastes
Conshohocken, PA — Heraeus Elec- tronics has expanded its popular family of low-temperature solder pastes. The recently developed Her- aeus F 498 solder paste has been de-
vices. It offers excellent wetting per- formance, provides extremely low beading and is RoHS-compliant. The paste supports the switch from wave- soldering to SMT with higher prod-
Low-temperature SMT solder pastes.
signed for extremely low mid-chip balling and contains BiSn57Ag1 alloy for higher reliability in a vari- ety of applications, including auto- motive, LED Level 2 and consumer electronics.
Developed to help manufactur-
ers address the competitive cost chal- lenges of the market, while deliver- ing superior performance, Heraeus F 498 lead-free, low-temperature sol- der paste is specifically designed for step-soldering when a second, lower temperature reflow process is need- ed. It is suitable for temperature-sen- sitive components, as well as the flexible circuitry used in smart de-
uct quality and can be used in tem- peratures up to 230°F (110°C). The F 498 paste also provides
reduced energy consumption in the reflow process due to lower reflow temperature and less requirements for production floor and PCB cooling. In a high-volume factory, low-tem- perature soldering can be done with a single-pass process, offering signif- icant savings in electrical usage and
a reduction of CO2 emissions. Contact: Heraeus, Inc., 24
Union Hill Road, West Conshohock- en, PA 19428 % 215-944-9981 E- mail:
jeffery.oddo@heraeus.com Web:
www.heraeus-electronics.com
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