Page 22


www.us-tech.com


May, 2018


Commercially Available, Hands-Free MIC Device Assembly


By Jim Angeloni, COO — Defense and Aerospace Operations, NEO Tech T


he reliability of gallium nitride (GaN) device technology has improved significantly, making


it a viable technology for both mili- tary and commercial microwave inte- grated circuit (MIC) applications. IC manufacturers are migrating to GaN and other advanced semiconductor compounds to address next-gen, high power output applications. In several military radars, for example, GaN- based devices have demonstrated five to ten times more power density than gallium arsenide (GaA) or sili- con power devices.


The Need for Automation While designers can reduce the


size of a device using GaN technolo- gy, it creates new complications. The more sophisticated the device, the thinner and more fragile the air- bridged die, the higher the number of I/Os, and the smaller the pitch be-


In military radars, gallium nitride (GaN) based


devices have demonstrated five to ten times more


power density than gallium arsenide (GaA) or silicon power devices.


NEO Tech’s automated MIC production line.


ly. Conventional methods of handling complex ICs typically have been la- bor intensive, with unique process challenges in picking, placing, and wirebonding, leading to lower yields and reduced reliability. To overcome these labor-inten- sive, process-dependent elements,


lower costs and enhanced reliability. NEO Tech was one of the first


U.S. companies to bring commercial- ly available, integrated automation to very thin and fragile semiconduc- tor dice, and the latest innovations are a significant extension of this achievement.


tween interconnects. These micro- miniature structures make it more difficult to assemble rapidly, accu- rately, consistently, and economical-


NEO Tech introduced a new genera- tion of assembly automation, as well as more sophisticated levels of process characterization, enabling


In existing manual or semiauto-


mated lines, operators must subjec- tively judge the coverage under the die and visually estimate the permis- sible amount of material extruding from the edges, which becomes high- ly variable. NEO Tech’s automated production line measures and per- forms this task more accurately, pro- ducing significant gains in repeata- bility, quality and reliability. For GaN and similar advanced


dice or ICs, truly hands-free automa- tion requires an accurate, high-reso- lution method for dispensing the pre- cise amount of epoxy every time. The die-bonding platform must be con- stantly stable, regardless of fluctua- tions in temperature and humidity. NEO Tech’s machine configuration is designed to consistently achieve high-precision epoxy dispensing.


Specialized Die Attach NEO Tech partnered with preci-


sion assembly equipment manufac- turer Palomar to develop and pro- duce specialized die-attach systems using optically balanced bread- boards, with internal dampening built into the honeycomb structure. The equipment’s resulting vibration damping supports precision die at-


Continued on next page


Electronic & Engineering Materials


Ask about our IPC-CC-830 / MIL-I-46058C conformal coatings designed for easy dip or spray application on printed circuit boards and surface mount devices.


® Member 314.621.5700 www.elantas.com/pdg


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120