February, 2017
www.us-
tech.com
Page 85 Acculogic: High-Volume Automated Test Systems
Markham, Ontario, Canada — Accu - logic now offers a range of in-line and end-of-line functional test systems, programming systems, and boundary scan test tools, including its FLS980 series III and Scorpion Briz test and
Materials Irvine, CA — Henkel is now offering its latest range of electronic materi- als, including solder, encapsulant, underfill, and thermal management materials. Introduced in 2015, the company’s LOCTITE GC materials have offered manufacturers solder pastes that are easy to transport and stable at room temperature. No- clean LOCTITE GC 10 and the water-soluble GC 3W have been designed to increase productivity and lower manufacturing costs. The company has introduced its
Henkel Elec. Presents Latest Electronic
programming station. The FLS980 flying probe tester
can be equipped with the company’s Ultimate Accuracy Package, along with such high-throughput features as the latest version of Acculogic’s flying bed-of-nails (FBON). The company also offers ThermoScan thermal imag- ing and MicroScan miniature image observation and testing solutions. The Scorpion Briz is a compact,
totally customizable, all-in-one test station. It can be configured to per- form in-circuit, functional and bound- ary scan testing, as well as in-system programming. In a single manufactur- ing stage, users can achieve a high level of test coverage and perform device programming with high
throughput, making the Scorpion Briz an affordable and versatile tester. The company’s comprehensive line of boundary scan test tools can
be used in the entire product lifecy- cle, starting with design verification and validation and continuing to full production. Use of these tools in field service and repair depots can help further reduce test cost and cycle time. In addition, Acculogic’s Scan - Navigator integrated boundary scan test environment offers a quick, easy and cost-effective way to perform boundary scan tests using Tera - dyne’s Di series of C-size VXI digital
test instruments. Contact: Acculogic, Inc., 175
Riviera Drive, Markham, Ontario, Canada L3R 5J6 % 905-475-5907 E-mail:
reg.leblonc@acculogic.com Web:
www.acculogic.com
FLS980 flying probe tester. See at IPC APEX, Booth 909
LOCTITE HF 2W, another solder material in the water-washable fam- ily. This tin-lead formulation deliv- ers a wide process window, allowing for reflow at high temperature and robust joint formation between the tin-lead paste and lead-free compo- nents. With fine-pitch compatibility and a flexible post-assembly residue cleaning window of up to seven days, the material meets the requirements of demanding applications while delivering process flexibility. Known for its simplified process-
ing and device protection, Henkel’s TECHNOMELT portfolio continues to expand its material functionality. TECHNOMELT TC 50 is a thermally- conductive hot melt that provides the ability to encapsulate and cool devices with a single material. Well-suited for applications such as LED drivers, automotive electronics, solar invert- ers, power supplies, and camera mod- ules, TC 50 has a thermal conductivi- ty of greater than 0.5 W/mK to allow for heat dissipation through the en - capsulating layer. To streamline the masking
process, the company has developed its TECHNOMELT AS 8998, a peel - able, precise, dispensable material. AS 8998 is a new and efficient replace- ment for the manually-applied tapes used to mask areas of the PCB prior to coating. The material can be deposited precisely by automated dispensing equipment, solidifies upon cooling and releases cleanly from various sub- strates. The company’s BERGQUIST
brand of liquid-dispensed thermal interface materials (TIMs) are designed to deliver gap-filling prop- erties for robust thermal control and can be dispensed by automated equipment. With a range of thermal conductivities from 1 to 4 W/mK and silicone, non-volatile, and non-sili- cone base chemistries available, the liquid TIMs offer many options to
designers of next-generation devices. Contact: Henkel Electronic
Materials LLC, 14000 Jamboree
Road, Irvine, CA 92606 % 714-368-8000 fax: 888-943-6535 E-mail:
doug.dixon@henkel.com Web:
www.henkel-adhesives.com
See at IPC APEX, Booth 1501 and at ATX/MD&M West, Booth 411
For more information visit
www.rehm-group.com or call + 1 770 442 8913
See at APEX, Booth 1901
Best possible soldering results with and without vacuum
VisionX-Series Convection Soldering
CondensoX-Series Condensation Soldering
IPC
Apex Expo Las Vegas,
Feb, 14–16 #1901
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