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www.us-
tech.com
February, 2017
World-Class Placement for Mid-Speed Applications
By Nick Crocker, E by SIPLACE Business Development Manager, ASM
and a hard place when deciding on the best placement technology for a dynamic assembly environment. While many features of higher-speed systems, such as vision inspection, placement head flexibility and easy- to-use software are desirable for the mid-speed market, the cost of high- volume placement platforms for mid- volume use doesn’t necessarily make sound economic sense. But, as today’s manufacturing
M
operation in the mid-speed sector becomes more complex with increas- ing product variation, challenging NPI demands, shorter planning cycles and stringent build-to-order requirements, the need for a more capable system to manage remote programming and ongoing set-up changeovers is greater than ever before. Naturally, high-quality results
and cost-competitiveness for the mid- range market remain key considera- tions for any high-mix manufactur- ing operation. With these realities at the fore-
front, a new approach to the mid- speed placement sector has been developed. Leveraging the engineer-
High-quality results and cost-competitiveness for the mid-range market
remain key considerations for any high-mix
manufacturing operation.
ing ingenuity of its high-speed plat- forms, ASM Assembly Systems has created a powerful, performance- packed solution for the mid-speed market. E by SIPLACE, which made its debut in the U.S. market in early 2016, has been designed for mid- range, multi-product, high-change - over environments that demand superior flexibility, ease-of-use, qual- ity, and affordability.
Flexibility The product variation seen by
today’s high-mix electronics assem-
E by SIPLACE provides advanced, affordable technology for the mid-speed sector.
product. Within an exceptionally small
footprint, and with an
ergonomic design for easy access, the new ASM placement technology offers highly-flexible machine config- uration options. Available as a dou- ble-sided machine with 120, 8 mm (0.3 in.) feeder slots, or as a single- sided machine with 60, 8 mm feeder slots for special applications, the placement system, which can also be fitted with fixed or changeover tables, is built for versatility. Add to this the flexibility in
placement head offerings, and the platform’s capability for the mid-speed market is even more obvious. A single gantry is fixed with ASM’s placement head technology, which can be config- ured with high-speed heads or flexible heads to address varied component types — from multi-nozzle collect-and- place options,
tions including LED strip lighting and industrial PCBs, the placement system is available with a long board option. The mid-speed sector is dynam-
ic, with product requirements chang- ing frequently and, therefore, requir-
id-speed, high-mix manufac- turers have often found themselves between a rock
bly firms can be daunting, but the new placement system helps over- come the complexity with a single machine that can build virtually any
reliability of up to 99.7 percent, with the CP14 head placing 01005-sized parts. When manufacturing long boards, up to 1.2m (4 ft), for applica-
offers manufacturers peace-of-mind that the technology investment can manage the product assembly demands of today and tomorrow.
Quality and Accuracy Placement accuracy has a sig-
nificant impact on end-of-line prod- uct quality, so its importance cannot be understated. With its digital vision system, the placement system is distinguished from conventional laser systems which only identify the outside edges of a component. ASM’s vision technology incorporates 100 percent lead and bump inspection for each component prior to placement, leveraging individual lighting config- uration for every component to cap- ture lead details rather than only component shape. Though supplied with a large
library of standard components and vision files, E by SIPLACE’s vision system also seamlessly adapts to new products and devices with an easy-to-use component teach technol- ogy. This feature can even teach com- plicated patterns, such as asymmet- rical BGAs, in seconds, as opposed to individual programming, which can take hours or days to complete. Intelligence is built into the sys-
tem’s digital vision inspection, with the ability to check for bent pins or leads, component orientation and cross-referencing of the component
to combination
collect/pick-and-place heads, to a twin- head configuration. The company’s placement head
design includes adaptive pick-up capability, which ensures a pick-up
The system’s placement head offers a range of options for production flexibility.
ing adaptive systems to cope with significant product variation, run quantities and reduced planning cycles. The flexibility of E by SIPLACE
image to the known component data. Part integrity is further ensured with placement force control, which is stan- dard with all placement heads.
Continued on page 66
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