Page 66


www.us- tech.com


February, 2017


How to Properly Calculate Reflow Temperature Gradients Continued from page 60


ond. You need only to study the specs and set the profiling software to perform slope calculations at the component and solder paste supplier’s specifi- cations for time interval. Just make sure that the profiling software is capable of measuring the max slope over any duration limit. If there are several temperature-sensitive


components with different specs, there are two approaches. First, use the most stringent specifica- tion for all components. Second, if the profiler sup- ports different specs for each thermocouple (TC), you can attach the TCs to the critical components, making sure all of them are within their individual specs. This will be easier to achieve than the “low- est common denominator” approach of the first method. The larger challenge will be to set up the reflow oven to achieve a profile that accommo-


dates the more demanding slope specs when using the correct calculations. Again, today’s profiling


software with prediction algorithms will do a good job of automatically selecting the appropriate oven recipe. If, however, the slope specifications are defined by the client, and your reflow oven is not capable of achieving them even with a powerful prediction software, then you may need to investi- gate further. Ensure that everybody involved is clear on the full definition of the thermal process window and the correct methods to calculate it. This is not a discussion of semantics but


whether you are running your production in or out of spec, with all the risk entailed. Being careful to calculate the reflow profile


correctly will help ensure that the final electronic assemblies are of the best quality. With today’s advanced technology enabling


10-second slope measurements in increments of 1 second.


higher process efficiencies across the board, paying close attention to the method of temperature slope calculation is no longer an option, it is an imperative. Contact: KIC Thermal, 16120 W


TECHNICA, U.S.A. Fulfilling Manufacturing Needs Throughout the Electronics Industry


Bernardo Drive, San Diego, CA 92127 % 858-673-6050 fax: 858-673- 0085 E-mail: abailey@kicmail.com Web: www.kicthermal.com r


World-Class Placement, Mid-Speed Applications


Continued from page 56 Programmable placement force


for every component guards against part, board and nozzle damage, while auto-adaptation to variations such as board warpage helps protect against drop placements. Eliminating possi- bilities for error and significantly reducing end-of-line rework require- ments, the system is designed to deliver high-quality assemblies.


Ease of Use The ease with which program-


ming, set-up, operation and mainte- nance can occur are important for any equipment decision, but especially in the mid-speed market where engineer- ing staff often manage multiple roles. This is another area where the place- ment system excels, making job setup remarkably simple and changeover fast and uncomplicated. At the outset, the simplified


Finest achine arts Compact Design Easy aintenance


German Engineering Modular Design Flexible and Scalable


1-800-909-8697 • www.technica.com Available exclusively through Technica, U.S.A.


See at APEX, Booth 3449


EXPO 2017 San Diego, CA Booth #349


Visit us at IPC APEX


programming possible with E-PRO software makes establishing a new job an easy task. Programmable from the machine itself or from a PC, E- PRO software takes the job, the placement list, components and feed- er setup and optimizes the product on a single machine or a balanced line for the most effective rate of components per hour. Controlled with a mouse or by a


touchscreen, necessary set tings are easy to manage. Leveraging the same high-speed


technology employed on other ASM equipment, the system’s closed-loop control system and linear motors have eliminated all belts and lead screws for accuracy with no calibra- tion necessary. Maintenance requirements are


minimal, making the platform robust and sustainable for the long-term. Closed-loop control also drives intel- ligent feeders. ASM is known for its advanced


feeder technology and this same engineering has been built into E by SIPLACE’s Smartfeeder E feeders. Continued on next page


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124