February, 2017 Continued from previous page
which makes setting up the camera for each assembly seamless and quick.
Powerful Laminography “We chose the Nikon system be-
cause of the
X.Tract software,” says Jason Sciberras, Lectronics manufac- turing manager. “The laminography technology gives us an unprecedent- ed, magnified view of any ball under-
www.us-
tech.com Lectronics Gains X-ray Vision
in-depth analysis during trou- bleshooting that will be enormously beneficial to Lectronics’ test engi- neers. In previous cases of unknown test failures, if the board had a mi- cro-BGA or QFN, the PCB assembly may be sent out for cross-sectioning and destructive testing to determine the root cause. By examining these components in-house, without de- stroying the PCB, the company will not only guarantee a faster resolu- tion to test fallout, but also save clients precious time and money. The 3D X-ray technology will be
beneficial to the company’s mechani- cal assembly technicians as they as- semble and complete different types of box build products. Of all the different products that Lectronics assembles,
electro-mechanical builds make up about 40 percent of the total business.
closed box build units to guarantee that everything is sitting correctly in- side of the unit. The X-ray system will prove that components are not put un- der any additional stress after me- chanical assembly is finalized. The Inspect-X feature provides
Close-up 3D rendering of
BGA balls on a specific plane and angle.
With this new 3D X-ray analysis, technicians will be able to see inside
a full, real-time, automated reporting system that details the X-ray sys- tem’s inspection results. Reports are fully customizable and will detail the analyzed results of the specific com- ponents that were inspected with both 2D and 3D images of the solder connections underneath components. The Inspect-X reports also clearly de- fine passed and failed components with quantifiable data. These Inspect-X reports are
Continued on page 27
Page 23
Jason Sciberras, manufacturing manager, and Denise Keunzer, senior process engineer,
operating the Nikon XT V (Credit: Desiree Molnar).
neath a BGA. Even if the BGA has 2,000 balls, I can examine each one individually from any angle. This technology will completely revolu- tionize how we measure appropriate connections.”
X.Tract works by taking 2D im-
ages at the sub-micron level 360° around the PCBA or component of interest. Those sliced, 2D images are then reconstructed into a detailed 3D model that can be analyzed on any plane with the
X.Tract analysis tool. The highly-magnified 3D image will give the company’s technicians insight into defects that are typical-
Standard 2D sliced X-ray shot.
ly obscured in standard 2D X-ray systems, such as head-on-pillow (HoP), open solder joints and cracks.
X.Tract also isolates views of the dif- ferent layers of complex component packages such as package-on-pack- age (PoP) or multi-chip modules. As Lectronics’ customers con-
tinue to design highly-complex, ex- tremely dense circuit board assem- blies, it’s crucial that both the com- pany’s manufacturing technicians and its engineers can properly in- spect and guarantee the manufac- turing quality of those products. “This is a new tool for looking at things we haven’t been able to see before,” comments Alex Johnson, as- sociate engineer at Lectronics.
Quality Improvements The enhanced visual inspection
of the Nikon X-ray system will afford See at APEX, Booth 1235
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124