February, 2017
www.us-
tech.com
Page 57 Optimizing Multi-Board System Design By Craig Armenti, PCB Marketing Engineer, Mentor Graphics
decade. Many of the products that we use today are, in fact, complex inter- connected systems. Simply put, a “system” is a hierarchical integration of sub-components that are combined to create a product. Using the automotive market as
D
an example, the first level of a system is an element: an individual compo- nent or sub-assembly that is designed to be part of a larger collaborating function. At the next level is the sub- system, which could be a single board that when connected with other boards delivers a higher level of value. The systems level is then an electron- ic-centric assembly packaged as mul- tiple boards interconnected with cables or connectors that can operate as a standalone unit. Finally, the sys- tem of systems level is an integration of independent systems that create a new, more complex system.
Multi-Board Systems: Multiple Issues
When hardware functionality is
distributed across a multi-board sys- tem, the system integrator must determine the connections that need to be made between each board and to external interfaces. As design com- plexity rises, there could be thou- sands of connections that need to be properly managed. Another way to appreciate the
complexity of system design is with the ubiquitous V diagram. The V dia- gram represents the design process starting with concept development through architecture definition, then decomposition of the system into individual blocks representing the physical implementation as hard- ware, mechanical enclosure, cabling, and software, and finally, the inte- gration, verification and manufac- ture of the components into the sys- tem product. As hardware system design
complexity continues to increase, the current methods for managing infor- mation have reached limitations in terms of both capacity and process. Existing system design methods take too long, introduce too many errors from manual data entry, and require re-entering the same data at multi- ple points in the design process. When designing a system, failure to maintain the integrity of even a sin- gle interconnection could result in project delays, involve significant cost to resolve, and perhaps even require a product recall. Today’s product development teams need to utilize an optimized multi-board sys- tems design process in order to be successful. To build these systems well, engineering teams must man- age design complexity and increase and improve collaboration. Manage Design Complexity. The scale of systems is outpacing the cur- rent design methodologies that often leverage homegrown processes to glue multiple disciplines together. These non-optimal processes restrict the trade-offs and “what if” analyses required across multiple domains. Collaboration. In order to properly optimize the system, collaboration between the different disciplines is
Proprietary Multi-Reflection Suppression (MRS) technology
AWARD WINNING
2015 SMT Vision Award 2015 EM Asia Innovation Award 2015 Global Technology Award 2016 Global Technology Award
Watch the SQ3000 on YouTube at
http://bit.ly/1C9ouaM
The Ultimate in Speed and Accuracy
The SQ3000 3D AOI winning combination: Superior image accuracy enabled by MRS technology Production speed enabled by multi-view 3D sensors Easy-to-use with intuitive interface
11:29 AM Example of a multi-board system. ™
esigning electronic systems has become measurably more complex during the past
no longer optional, it is a require- ment. Today, teams tend to work
within a silo, with a black box methodology that restricts optimiza-
tion across the various components of the system. This reduced collabora- tion results in redundant efforts between disciplines.
Process Optimization In order to truly optimize the
multi-board system design process, product development teams need to use tools that maximize their effi- ciency. These tools should eliminate redundant efforts while simultane- ously improving product perform- ance and reliability. The data man- agement infrastructure must ensure
Continued on page 59 SQ3000 3D AOI
www.cyberoptics.com Copyright © 2017. CyberOptics Corporation, Inc. All rights reserved. See at APEX, Booth 2809
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124