February, 2017
www.us-
tech.com
Page 83 ASTER Intros System-Level Board Viewer
Colorado Springs, CO — ASTER Technologies has introduced its twSystem™, a system-level board viewer. The viewer can be used in the design environment to assist DFT and test coverage analysis at the schematic capture stage as well as during prototype troubleshooting. In the manufacturing environment, it
Saki to Exhibit Smart Factory 3D AOI and SPI
Fremont, CA — Saki has developed a line of smart factory-enabled 3D AOI and SPI systems that can be used to communicate with equipment in PCB assembly lines to ensure that the boards are produced efficiently and adhere to high standards of qual- ity and reliability. The company’s algorithm-based
software provides extensive pro- gramming capabilities. According to the company, it is easy to program and provides enough flexibility so that operators can zoom in on small areas, see components, solder, board, and defects from every angle, with- out requiring programming experi- ence. Offline programming emulates the machine, allowing programming and debugging to be done without having to rescan a board once initial
becomes an integral part of the repair cycle, assisting in fault loca- tion to significantly reduce repair time.
The viewer is designed to
import native CAD data for each board in the system. A formal description of the backplane or cables is used to define the intercon- nection of the boards. The viewer is powerful enough to handle the load- ing, viewing, searching, and naviga- tion of systems that include more than 10 boards with 3,000 compo- nents each. Once a system’s CAD data is
loaded, twSystem provides various representations. The first is a list of the boards, backplanes and cables in
twSystem system-level board viewer.
the system. When a board is part of an interconnection, the correspon- ding connection is highlighted. The program also offers a flat netlist view, which is the foundation for
navigating between interconnecting boards within a system, along with a mechanical, interactive 3D view of the box, which includes the boards. The viewer provides a window
for each active board. Each win- dow combines the BOM, schemat- ic layout diagram and the CAD layout. The viewer also contains 3D modeling and visualization to support future AOI, AXI, FPT,
and ICT program generation. Contact: ASTER
Technologies, P.O. Box 7163,
Colorado Springs, CO 80933 % 719-264-7698 E-mail:
will.webb@aster-technologies.com Web:
www.aster-technologies.com
See at IPC APEX, Booth 3844
Saki’s BF-3Di AOI system in a smart factory production line.
board image is captured. Changes to programs can be made on-the-fly, without having to stop the manufac- turing or inspection process. Saki’s BF-3Di AOI system pre-
cisely inspects and measures the height of all devices on a printed cir- cuit board and detects defects such as lifted leads, tombstones, reverses, and height variations at high speeds and cycle times. According to the company, the 3D BF-3Si SPI system is one of the world’s fastest two-projector solder paste inspection systems available. Its phase measurement profilometry with liquid crystal on silicon (LCoS) tech- nology ensures high repeatability of
inspection results. Contact: Saki America, Inc.,
48016 Fremont Boulevard, Fremont, CA 94538 % 510-623-7254 E-mail:
sales.us@
sakicorp.com Web:
www.sakicorp.com
See at IPC APEX, Booth 2909 See at APEX, Booth 1909
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