February, 2017
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Page 81 SEHO: Latest Selective and Wave Solder Systems
Erlanger, KY —SEHO North America is now offer- ing a complete line of selective soldering and wave soldering systems. The company’s GoSelective-LS selective soldering system has been designed par- ticularly for the standalone production of small- and medium-sized volumes in a compact size. The system is equipped with a loading and
unloading station for carriers up to 20 x 20 in. (51 x 51 cm) in size. Boards can be assembled in one carrier while a second carrier is being processed in the machine. All process steps are completely auto- mated. The machine has a precise axis system that positions the drop jet fluxer, preheat unit, and sol- dering unit during the process. Depending on the requirements, the electromagnetic soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times. SEHO also offers its SelectLine-C selective sol-
dering machine, which incorporates a fluxer station, various preheat sta- tions and several soldering stations that may be equipped to meet differ- ent manufacturing requirements. The company’s Synchro software allows for a boost to production volume without major investment. A brush station for
Alpha Intros Lead-Free No-Clean Solder Pastes
Somerset, NJ — Alpha Assembly Solutions has introduced two new lead-free no-clean solder pastes. ALPHA® OM-353 is an ultra-fine fea- ture print- and reflow-capable solder paste that is useful for assemblies sen- sitive to component warpage, or for processes that require cleaning. The paste exhibits excellent printing per- formance down to 180 µm pad sizes. OM-535 is a low-temperature
paste with excellent drop shock resist- ance and electrical reliability for low-
the removal of residues after soldering and an AOI station for immediate inspection of solder joints can be integrated into the system. All of SEHO’s selective soldering systems
have 100 percent process control, with fiducial recognition, flux quantity control, wave height con- trol, process visualization, mcServer and many more value-added features. The company’s auto- matic ultrasonic nozzle cleaning function also improves the process and maximizes machine availability. SEHO has also developed a new plasma
process that deposits flux powder onto the surface of the PCB. Due to lower overall residues, the process can improve product quality and reduce machine downtime, resulting in reduced cost for
production processes. Contact: SEHO North America, Inc., 1420
Jamike Drive, Suite 300, Erlanger, KY 41018 % 859-371-7346 E-mail:
sehona@sehona.com
GoSelective-LS selective solder system.
Web:
www.sehona.com See at IPC APEX, Booth 2309
Lead-free no-clean solder pastes.
temperature reflow applications. It demonstrates good solder joint and flux residue cosmetics, even when sub- jected to long or high thermal soaking. The company developed the
pastes to meet new printing chal- lenges and performance demands. Each has certain aspects tailored to address reliability concerns. OM-353 has transfer efficiency with small area ratios and ensures high pick- and-place yields along with self- alignment. The enhanced properties of low-temperature SBX02 alloy com- bined with the advanced chemical performance of OM-535 enables the formation of a good solder joint by improving the mechanical process and cosmetics using low-temperature
process settings. Contact: Alpha Assembly
Solutions, 300 Atrium Drive, Somerset, NJ 08873 % 908-791-3045 fax: 908-791-2399 E-mail:
laurie.kneller@
alphaassembly.com Web:
www.alphaassembly.com
See at IPC APEX, Booth 2901 See at APEX, Booth 1933
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