LEDs ♦ news digest
emerging applications areas such as Hybrid & Electric Vehicles (HEV), PV inverters and smart meters are driving this market growth.
Although these applications currently only make up a relatively small proportion of the total high performance optocoupler market, with compound annual growth rates of up to 10% - 20% from 2013 to 2018 they have attracted a number of existing suppliers of optocouplers to participate in the market.
It is not only the optical isolation providers that see the emerging applications as a key focus, leading suppliers of non-optical isolation and increasingly seeing their products being adopted in these areas due to the increased reliability and higher product lifetimes.
In the infrared component market, many traditional product lines such as IREDs (Infrared Light Emitting Diodes), photodiodes/transistors have relatively low growth potential, with end unit numbers remaining relatively flat and penetration rates falling with Bluetooth and other connectivity technologies replacing Infrared.
However, there are significant opportunities in the consumer electronics space with OEM manufacturers rapidly adopting ambient light and integrated ambient light and proximity sensors in smart phones and tablet computers.
Ambient light sensors are forecast to grow from $252 million in 2013 to $379 million in 2018. With space so limited in smart phones, there has been an ongoing trend towards more integrated solutions in these products.
In 2013, mobile telecommunications account for over 99% of the total integrated ambient light and proximity sensor market. From 2014 onwards there will also be a new emerging application in gesture control for tablets, with revenues rising from near zero in 2013 to $244 million in 2018.
If optoelectronic component manufacturers can gain an early share in these high growth areas, there is potential for significant gains over the coming years.
Alliance orders EVG for SOI wafer bonding
SMART Low Energy Electronic Systems Group will leverage EVG 850LT in advanced compound semiconductor research for wireless ICs, power electronics, LEDs and other applications
MIT Alliance for Research Technology (SMART) has
ordered an EVG 850LT fully automated production bonding system designed for silicon-on-insulator (SOI) and direct wafer bonding using low-temp plasma activation processing.
SMART, which is a research centre established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilise the EVG850LT system to support its advanced substrate development efforts.
The MIT research centre is located outside the United States in Singapore and has five different research groups, including the Low Energy Electronic Systems (LEES) Research Group, which focuses on integrating silicon CMOS and compound semiconductor materials to enable new integrated circuits (ICs) for wireless devices, power electronics, LEDs, displays and other applications.
The LEES Research Group features a facility, where the EVG850LT has already been installed and is in use.
According to Professor Eugene Fitzgerald from MIT’s Department of Materials Science and Engineering, SMART chose the EVG850LT for the centre’s advanced R&D efforts due to the system’s high process flexibility and performance, EVG’s experience in low-temperature bonding, and expertise and support in process development.
“The charter of our LEES Research Group is to identify new IC technologies that enable devices that consume less power, enable higher performance and open up new applications for information systems. EV Group’s technology and expertise will play an important role in supporting this effort,” states Fitzgerald.
The EVG850 platform, upon which the EVG850LT system is built, is the only SOI and direct wafer bonding platform designed to operate in high-throughput, high- yield environments—establishing it as the industry standard in the SOI wafer bonding market.
The EVG850LT platform combines all essential steps for wafer bonding—from cleaning and alignment to pre- bonding and IR-inspection- in a single platform.
This ensures an ultra-clean production process throughout all stages to enable high-yield, void-free wafers, as opposed to stand-alone processing units that require the wafers to be manually transported in a regular cleanroom environment.
The EVG850 supports a variety of advanced substrates, including SOI and silicon on lattice engineered substrate (SOLES) technology, up to 300 mm in diameter.
“EVG has been at the forefront of SOI technology January / February 2014
www.compoundsemiconductor.net 89
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