NEWS REVIEW
3D-Micromac acquires the TLS-Dicing technology of Jenoptik
JENOPTIK is transferring its thermal laser separation (TLS-Dicing) technology as part of a so-called asset deal to 3D-Micromac AG.
As of January 1st, 2014, know-how, patents and results of the development from Jenoptik’s Laser & Materials Processing Division have been transferred to 3D-Micromac AG in
your
EPITAXIAL GROWTH partner
Chemnitz. Immediate commercialisation of the technology by 3D-Micromac will be possible with the transfer. With the acquisition, the company reinforces its know-how as a system provider for laser systems in the semiconductor industry and advances the expansion of its product portfolio in this area. Jenoptik’s Laser & Materials Processing Division will continue in the future to focus on the
3D processing of plastics and metals, for example in the automobile industry.
According to Tino Petsch, CEO of 3D-Micromac AG, TLS-Dicing will enable the company to obtain a technology that will perfectly complement its product portfolio in the semiconductor industry and enable it to expand its market position.
Petsch adds, “In addition to component processing at wafer level we can now also offer innovative solutions for separating of microchips. In the coming months, we will continue to further develop the process in co-operation with the Fraunhofer IISB and implement it in industry-ready machine technology.” “Jenoptik’s Laser & Materials Processing
Enabling advanced technologies World leading technology
Complete materials range MOCVD, MBE, CVD
Advanced semiconductor wafer products
Advanced R&D capabilities Multiple, manufacturing sites
(Europe, Asia, USA)
Division has increasingly focused on its core markets and sharpened its portfolio in recent months,” says Dietmar Wagner, general manager of Jenoptik Automatisierungstechnik GmbH, following the contract’s signing. ‘We are pleased that with 3D-Micromac AG we have found a buyer for TLS-Dicing, which wants to successfully commercialise the technology in the shortest possible time”.
TLS-Dicing (thermal laser beam separation) is used in the semiconductor industry’s back-end to separate semiconductor wafer in components. A laser heats up the material locally and a cooling medium cools it down immediately afterwards.
www.iqep.com 14
www.compoundsemiconductor.net January / February 2014
The thermally induced mechanical stress leads to a complete cleaving of the wafer. The method is suitable for most brittle materials in the semiconductor industry, including silicon, SiC, germanium and GaAs wafers.
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