LEDs ♦ news digest
portfolio of Osram Opto Semiconductors, occupying the output range between Power TopLED and Oslon Black.
The new IRED accommodates a small powerful chip with an edge length of 750 µm and half the footprint of standard chips in the Oslon Black. With package dimensions of 1.6 mm x 1.2 mm x 0.8 mm the Oslon Compact is not much larger than the chip itself and is therefore one of the smallest in its output class.
“Even so, our new Oslon Compact has excellent heat dissipation properties and can operate at high currents,” says Jörg Heerlein, responsible at Osram Opto Semiconductors for product marketing for infrared components in the industrial sector.
“The high output, which is achieved thanks to state- of-the-art thin-film chip technology, combined with the small package, opens up numerous new applications, particularly where there is very little available space but performance demands are high. And if required, components can be packed very close together to increase the optical output with a high degree of flexibility.”
Applications with or without external optics
The infrared 850 nm LED has an emission angle of +/- 65° and does not need internal optics or reflectors. Its light can however be successfully injected into narrow- angle external optics. It has a thermal resistance of less than 25K/W.
With external optics it is ideal for illumination in surveillance applications and for machine vision tasks such as pattern recognition and 3D measurement because the wavelength of 850 nm is barely perceptible to the human eye but can be very easily detected by camera systems.
Without external optics the IRED perfectly covers the near-field range of a few metres and is therefore suitable for example for eye tracking and gesture detection.
IQE provides trading update
Revenues for 2013 is expected to be at least £126 million, an increase of over 43 percent compared with 2012
IQE has provided a trading update for the year ended 31st December 2013.
Trading in H2 2013 is expected to show sequential growth, despite weak guidance for Q4 2013 and Q1 2014 from a number of IQE’s wireless customers, and a
January / February 2014
www.compoundsemiconductor.net 73 significantly strengthening sterling/dollar exchange rate.
As a result, revenue for full year 2013 is expected to be at least £126 million (2012: £88 million), representing a new record and an increase of over 43 percent compared with the prior year.
Strong sales growth and improved operational efficiencies are expected to deliver a record EBITDA of at least £24.5 million (2012: £16.4 million).
Adjusted fully diluted EPS is therefore expected to be approximately 2p (2012: 1.51p), an increase of over 32 percent compared with 2012.
The Group’s conversion of operating profit into cash is expected to reduce net debt to below £35 million at year end (June 2013: £37.7 million), even after the payment of approximately £14 million during 2013 in deferred consideration relating to prior acquisitions. The amount of deferred consideration payable in 2014 is expected to reduce from this level.
Towards the end of 2013, in addition to successfully renewing its existing contractual relationships with key wireless customers, IQE also extended its contractual share of future business. The group continues to diversify its business across non-wireless applications.
The board remains confident that the group can continue to deliver increased free cash flow over the coming year and beyond, as the business continues to diversify, and cost synergies from recent acquisitions are realised.
Drew Nelson, CEO and President of IQE plc, says, “I am very pleased to announce that we expect to report a record level of revenue and earnings for 2013 as a result of IQE’s increasingly strong position within the Compound Semiconductor Industry, and our rapidly strengthening product portfolio. As a result of strong cash flows we have also successfully reduced net debt and the deferred consideration owing on prior acquisitions.”
“We look forward to further increasing cash flows and earnings during the current year and beyond as we maintain our strong position in wireless and continue to leverage opportunities to exploit our products in other high-growth markets.”
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