news digest ♦ LEDs
This new contract aims to support Soitec’s strategy for the electronics, solar energy and lighting markets. It will focus on engineered substrates and materials offering higher performances and energy savings at a competitive cost.
The partnership is putting in place an R&D ecosystem aiming to reduce research to product time to market.
Thanks to the strengths of CEA-Leti in electronic materials, multi-domain research and its pre- industrialisation infrastructure, competitive R&D sample prototyping will be possible. This will be enabled through a common platform, reducing time to market and R&D costs for Soitec and its customers.
The CEA-Leti and Soitec teams will focus their efforts on developing new materials generations to support Soitec road maps in three markets (electronics, solar energy and lighting).
To do so, they will leverage the firms’ expertise and use Smart Cut technology and extended tool box as key assets to support the next generations of mobile devices, solar cells and LEDs.
Carlos Mazuré, CTO of Soitec, emphasises, “In our industry, competitive pre-industrialisation research, development of technology and product prototypes have become very important to make the difference. The CEA-Leti and Soitec partnership establishes a powerful alliance that is capable of answering the numerous challenges of today’s industrial requirements and building on our well-established material expertise.”
He adds, “The agreement aims at accelerating exploratory research as well as technology innovation to prepare the products of tomorrow. It complements the Soitec strategy of entering new markets with high- efficiency concentrating photovoltaic technology, high- intensity LEDs for lighting applications and engineered substrates for electronic applications.”
Laurent Malier, Director of CEA-Leti, says, “In recent years, Soitec has widely expanded its footprint and impact by addressing the electronics and energy challenges through its unique technologies which we developed together. Our partnership is the most efficient framework for securing research execution to support the ambitions of Soitec, and CEA-Leti teams are committed to its success.”
TrendForce: Chinese LED package companies are rising
While technical progress is still the greatest challenge, China’s chip market is dominated by LEDs
Market research firm TrendForce’s Green Energy Division LEDinside says that in 2013, the Chinese LED packaging market value increased far quicker than the global average.
LED lighting is still the largest application field in the 2013 Chinese LED packaging market, accounting for 42 percent.
Due to the rapid growth of the Chinese LED commercial lighting market demand, Chinese lighting-use LED manufacturers such as MLS Lighting, Honglitronic, CF Lighting have performed outstandingly.
High-quality indigenous chips greatly improved the competitive position for Chinese LED lighting-use in the LED packaging industry. According to LEDinside, indigenous chips have accounted for almost 80 percent in the 2013 Chinese chip market.
In the backlighting field, LEDinside analyst Allen Yu says that with the support of Chinese TV and mobile phone manufacturers, mainland package manufacturers gradually replacing those in Taiwan, Japan and Korea in the market has become an irreversible trend.
In the TV backlighting field, Refond, DSBJ, AMTC, Shineon and other manufacturers have all performed well and entered into China’s top six TV manufacturers’ supply chain.
Supplying products for brand manufacturers can not only significantly improve quality control and management capability of Chinese LED package industry, but also help Chinese package manufacturers to accumulate
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www.compoundsemiconductor.net January / February 2014
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