February, 2019
www.us-tech.com
Page 99 Koh Young Demos AI Applications for Inspection
Chandler, AZ — Koh Young is high- lighting how artificial intelligence (AI) solutions and machine learning can
pany has been focusing on the poten- tial of AI to improve throughput and production quality in several ways. Koh Young is showing its latest
3D AOI platform, the Zenith 2, which allows simple programming, without fine-tuning. The system includes the AI-powered Koh Young Auto Programming (KAP) system. The tool recommends inspection condi- tions based on 3D-measured data, which can reduce job preparation time by up to 70 percent, making it an excellent solution for high-mix, low-volume applications. The Zenith 2 also offers expanded inspection capabilities with side-view cameras. Koh Young will also display
Koh Young aSPIre3 SPI system.
offer more consistent inspection results at IPC APEX 2019. With the ongoing trend of Industry 4.0, the com-
New High Temperature Underfill from Henkel
Irvine, CA — Anticipating the requirements for next-generation, high-reliability electronics applica- tions, Henkel Corporation has intro- duced its LOCTITE® ECCOBOND® UF 1173. The protective underfill material, which has been formulated with health and safety in mind, does not contain any reportable REACH SVHCs, is not CMR-classified and delivers outstanding performance under high operating temperatures.
Think BIG! – And be prepared for the future
Ersa VERSAFLOW 4 XL designed for PCB sizes of up to 610 x 1,200 mm
SAN DIEGO
JANUARY 29 – 31, 2019 VISIT US AT BOOTH 2706!
enhanced 3D SPI systems, including the KY8030-3 and aSPIre3. The
KY8030-3 will demonstrate ad - vanced features, including auto repair, which eliminate rework and scrap, while improving ROI by auto- matically dispensing solder paste on failed pads during production. Koh Young will also highlight the auto- verification function with its flagship aSPIre3 3D SPI, which helps ensure the best inspection results with auto- matic machine condition verification. Koh Young is also demonstrat-
ing its Industry 4.0 software, includ- ing the latest KSMART solutions with complete traceability. With improved module usability and ver- satility, users can simply click through menus to drill down into details for the information needed. The intuitive navigation process
spans collection and monitoring through analysis and maintenance to help users optimize the process. Koh Young is harnessing connec-
tivity with its award-winning Koh Young Process Optimizer (KPO) soft- ware. Koh Young will show KPO, in conjunction with its printer partners, which proactively optimizes the print process and reduces false calls. The company is also participating in an IPC-sponsored show floor demonstra-
tion of Hermes and CFX connectivity. Contact: Koh Young America, Inc., 6150 W. Chandler Boulevard,
Suite 39, Chandler, AZ 85226 % 480-403-5000 fax: 480-403-5001 E-mail:
america@kohyoung.com Web:
www.kohyoung.com
See at IPC APEX, Booth 1908
Ersa HR 600 XL automatic rework on large assemblies
S High-end selective soldering system to
integrate into in-line manufacturing concepts Product change without downtime
VERSAFLEX solder module x/y/z-variable Parallel process through separation
LOCTITE ECCOBOND UF 1173 high-temperature underfill material.
Henkel’s new underfill system
improves on older-generation materi- als, not only with its prioritization of health and safety, but also from a per- formance and processing perspective. LOCTITE ECCOBOND UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free inter- connect protection from shock, drop and vibration. Importantly, the under- fill exhibits high glass transition (Tg) temperature capability of 311°F (155°C) and a low coefficient of ther- mal expansion (CTE) to ensure robust protection performance under stress-
ful conditions. Contact: Henkel Electronic
Materials, LLC, 14000 Jamboree
Road, Irvine, CA 92606 % 714-368-8000 E-mail:
eva.laus@
henkel.com Web:
www.henkel-adhesives.com
See at IPC APEX, Booth 907, and at ATX/MD&M West, Booth 2919
Kurtz Ersa, Inc. 1779 Pilgrim Road Plymouth WI 53073 | USA Phone: +1 920 893 1779 Fax: +1 920 893 1562
selective.info@
kurtzersa.com
rework.info@
kurtzersa.com
of fluxing, preheating and soldering cycle Use of up to 4 flux spray heads with
two independent axes (2 spray heads per axis) Max. PCB size 680 x 610 mm (option 1,200 x 610 mm)
VERSACAM for solder wave height measurement on the fly Flexible system configuration
on account of modularity of the design
Highly efficient 800 W hybrid heating head Large-area IR Matrix bottom heater
with 25 single heating elements (600 W each) Process observation with up to 8 thermocouples
Automatic and precise component alignment with the help of machine vision
Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)
User independent, reproducible repair results guaranteed
Process control and documentation via the operator software HRSoft 2
VERSAFLUX SELECTIVE FLUX MODULE
Simultaneous fluxing and soldering on PCB panels in x- or y-direction
Kurtz Ersa México, S.A. de C.V. | Mexico Kurtz Ersa Asia Ltd. | China Ersa Hong Kong | China Ersa Shanghai | China Kurtz Ersa | France Ersa GmbH | Headquarters | Germany Kurtz Ersa Vietnam Company Limited | Vietnam
See at IPC APEX, Booth 2706 Ersa HRSoft 2 software package for HR 600 XL
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