February, 2019
Research Triangle Park, NC — To be held in Fountain Hills, Arizona, from March 4 to 7, 2019, at the We-Ko-Pa
Conferences Continued from previous page
SEMI to Hold Seven Major
September will see the Strategic
Materials Conference (SMC), sharing the latest developments from around the world in strategic materials, while October’s MEMS & Sensors Executive Congress (MSEC) will present how the next generation of MEMS and sensors will be designed and produced to meet ongoing growth for emerging markets beyond the traditional microelectron- ics customer base. Finally, the year will end with
the International Trade Partners Conference (ITPC) in early November, in order to advance productive trans- Pacific relationships to help avoid threatened supply chain prosperity, leveraging thought leadership and relationship-building programs for executive level engagement. Contact: SEMI, 673 South
Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 E-mail:
semihq@semi.org Web:
www.semi.org r
CES 2019: New World with 5G and AI
Continued from previous page
the possibilities of 5G. Executives from Adobe, Deloitte Digital, Magic Leap, National Geographic and The Stagwell Group explored how 5G will impact our lives. The panelists agreed that beyond supporting tech- nologies such as self-driving cars and VR, 5G promises to transform areas such as storytelling and marketing. During the keynote talk, “The
New Mobility Revolution,” Chris Urmson, co-founder and CEO of Aurora stated, “We’re here to stop fatalities on America’s roads, and globally. The status quo is not acceptable and we should do some- thing about it.” Aurora, along with the other panelists from Audi, Intel and the National Safety Council, are members of the newly-launched PAVE coalition which aims to edu- cate the U.S. public on the benefits of self-driving vehicles. From a global perspective, Amnon Shashua, presi- dent and CEO, MobilEye said, “The best area for mobility as a service to launch is the U.S., but we could not wait for the right regulations. In Israel, we’ve had a lot of support from the government.” The intersection of 5G, AI and
vehicles is a recurrent theme that is likely to grow over the course of the year. Other areas include, what the Internet of Things (IoT) and 5G can bring to retail and how better real- time networks can promote cyberse- curity.
Contact: Consumer Technology
Association (CTA), 1919 S. Eads Street, Arlington, VA 22202 % 703-907-7600 E-mail:
cta@cta.tech Web:
www.cta.tech r
SAN DIEGO CONVENTION CENTER, CA, USA
MEETINGS AND COURSES: JANUARY 26–31, 2019 CONFERENCE AND EXHIBITION: JANUARY 29–31, 2019
www.us-tech.com
Resort, IMAPS’ 15th International Conference and Exhibition on Device Packaging will focus on four key top- ical workshop tracks. The tracks comprise: 3D applications and tech- nologies; flip chip, wafer-level pack- aging and fan out; engineered micro systems/devices; and automotive packaging, a new track for 2019. The 3D applications and tech-
nologies forum brings together engi- neers, scientists, academia and other professionals who work with 3D inte- gration and high-density technolo- gies. The forum is organized to allow for the presentation and debate of some of the latest advancements in 3D packaging, as well as to bridge the gap between backend wafer-level 3D integration and 3D packaging.
The flip chip, wafer-level pack-
aging and fan out workshop will include presentations and discus- sions around the most recent devel- opments in FC, WLP and FOWLP technologies. The organizational committee includes representatives from GLOBAL FOUNDRIES, NXP, Atotech, and DOW. The engineered micro systems/
devices workshop brings together a wide range of industry professionals who have been working in the area of engineered miniaturized systems. Topics include prognostics, advanced sensors, MEMS/NEMS/ MOEMS, ad - ditive manufacturing, wireless de - vices, photonics, quantum devices, power electronics, and miniaturized electronic and mechanical systems.
Page 133 IMAPS 2019 to Showcase Four Topical Workshops Automotive is one of the fastest
growing applications in the semicon- ductor industry. Semiconductor packaging plays a critical role in achieving zero defects and high relia- bility in vehicles. The automotive track is focused on bringing together experts to discuss the automotive landscape, packaging requirements and how the industry is addressing challenges. Although a majority of the automotive packaging market is still using wirebond, the use of non- wirebond packages is growing, due to infotainment, ADAS and autono - mous driving applications. Contact: IMAPS, P.O. Box
110127 Research Triangle Park, NC 27709 % 919-293-5000 Web:
www.imaps.org/devicepackaging r
GET YOUR 20% DISCOUNT! WHEN YOU
REGISTER BY 12.21.2018
THROUGH NETWORKING
Technology’s future will literally come together in San Diego at IPC APEX EXPO 2019 on the exhibit show floor, in meetings, sessions and courses, and during networking events. The in-person exchange of ideas and know-how between you and your peers powers the industry’s future.
Whether you are established in your career or just starting out, IPC APEX EXPO 2019 will be the event to:
• Network with thousands of electronics industry peers • Make new connections • Strengthen existing relationships • Become a mentor/meet a mentor
Strengthen the opportunities for yourself and the entire industry — register today for IPC APEX EXPO 2019 at
ipcapexexpo.org.
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