Page 100
Liberty Lake, WA — Nordson SELECT is intro- ducing its Integra® 508.3 to the North American market. The Integra 508.3 is a multi-station selective
soldering system designed for high-volume appli- cations with maximum throughput. With its flexi- ble configuration, the machine is a versatile selec- tive soldering platform and can be equipped for either single, parallel or double processing. When configured with dual drop-jet fluxers and
dual solder pots, the Integra 508.3 can solder two boards at the same time in each soldering station. When operated in the parallel mode, the system can process up to six boards at one time, significantly increasing machine productivity. The company also offers a range of selective
soldering systems for various applications, including the Integra® 103ILD, the versatile Cerno® 103IL, and the compact Novo® 300.
Integra 508.3 high-volume selective soldering system.
www.us-tech.com
The Integra 103ILD is a dual-pot selective sol- dering system and contains Nordson SELECT’s
February, 2019 Nordson SELECT: High-Volume Selective Soldering
automatic solder nozzle tinning system. Unlike other nozzle cleaning systems, Nordson SELECT’s patent-pending system does not spray an adipic acid, or a liquid or powdered flux. This solder nozzle tinning system keeps the
solder nozzles clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles, without any resulting over- spray or contamination of the printed circuit board or the selective soldering machine. The Cerno 103IL is a fully-configured SMEMA
compatible selective soldering system equipped with standard features that include interchangeable sol- der pots and pumps compatible with tin-lead, lead- free and HMP solder alloys. The system comes standard with an automated
fiducial location and correction system that provides single-click fiducial teach capability, seamless fidu- cial recognition and true automated alignment and skew correction of a printed circuit board. The system also provides board
mapping and pattern recognition of a correct board assembly, x-out circuits or missing components. The Novo 300 is an entry-level
selective soldering platform with a compact footprint requiring less than 11.8 ft2 (1.1m2) of factory floor space. The system is a standalone platform designed for prototyping, cell manu-
facturing or small batch production. Contact: Nordson SELECT, 22425 East Appleway Avenue,
Liberty Lake, WA 99019 % 509-924-4898 E-mail:
bob.klenke@nordsonselect.com Web:
www.nordsonselect.com
See at IPC APEX, Booth 2119
ITW EAE: Variable Contact Wave Solder Nozzle
Minneapolis, MN — As PCB manu- facturers continue to implement automation into high-mix environ- ments, ensuring the wave soldering process has maximum performance flexibility is critical. To meet that challenge, Electrovert is introducing the DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first
nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the- fly as variable board types are run through the wave. This ensures sol- der contact time is optimized for a high-mix of board types, without changing conveyor speeds. The DwellFlex 4.0 provides a
high level of soldering capability for thermally challenging and difficult- to-solder applications. At full width it delivers the most thermal energy and longest dwell time capability in the industry. The DwellFlex 4.0 is flexible
enough to meet the high-mix require- ments of today’s board designs and technologies and is ready for the
smart factories of the future. Contact: ITW EAE, a division of
Illinois Tool Works, 8860 207th Street West, Minneapolis, MN 55044 % 952-469-8278 E-mail:
roger.dullinger@itweae.com Web:
www.itweae.com
See at IPC APEX, Booth 2914 See at IPC APEX, Booth 3339
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136
