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www.us-tech.com
SEMI Announces Schedule of Seven Major Conferences
Milpitas, CA — In the face of the microelectronics industry’s unprece- dented challenges and opportunities with artificial intelligence (AI) and new markets outside the historic semiconductor audience, SEMI has announced its Technology Leader - ship Series of the Americas. The seven-part sequence of related strat- egy and technical conferences com- prises a large and comprehensive approach for examining and fabricat- ing future innovations. As we enter an era where the
world’s volume of data doubles every 12 to 18 months, a global brain trust
of hundreds of industry experts has provided input for a coherent, step- by-step process that will position the microelectronics industry to navigate the future. With an objective to reduce
learning curves and shorten product times to market, key interest groups have rallied with SEMI, over the past 24 months, to multiply interac- tions with the supply chain. In turn, these exchanges are calculated to increase the members’ respective technical ROIs. Technology commu- nities include the Fab Owners Alliance (FOA), FlexTech, MEMS &
Las Vegas, NV — Technology innova- tion across every major and emerg- ing industry was unveiled earlier this month at CES® 2019, including the latest in AI, 5G, entertainment, sports, automotive, resilience, and smart cities. With keynotes from the leaders of AMD and AT&T, sessions featuring executives from Twitter, the National Football League, Walmart and Intel, along with thou- sands of product debuts, CES is a global hub for innovation transcends industries and fuels economic growth.
MediaLink Chairman and CEO
Michael Kassan kicked off a keynote by declaring to the crowd that “CES 2019 is, for all intents and purposes,
CES 2019 Unveils New World with 5G and AI
the dawn of 5G.” Kassan was joined on stage by AT&T Communications CEO John Donovan and the two dis- cussed AT&T’s efforts to make 5G a reality. Imparting on the crowd the significance of 5G, Donovan told attendees, “This network, really sim- ply stated, is not just faster and more efficient — which we’ve grown to appreciate — it’s a real-time net- work.” The two discussed the recent launch of AT&T’s 5G Evolution net- work, as well as AT&T’s work to make Rush Hospital in Chicago the first 5G-enabled hospital. Following their discussion,
Philip Thomas, chairman of Cannes Lions, moderated a panel discussing
Continued on next page 2019 EDITOrIAl AND ISSUE Jan/Feb March April/May EDITORIAL
Assembly & Automation APEX PP ATX West PP
Test & Measurement
SMT & Production Nepcon China PP SMT/Hybrid/PKG PP
EDS PP June July August
Components & Distribution ATX East /MDM PP
Production & Packaging Semicon West/Intersolar PP
PCB & Assembly Nepcon South China PP
September Assembly & Automation SMTAI PP
APEX DesignCon
ATX/Electronics West/MDM APEC
Nepcon China SMT/Hybrid/PKG Wire Processing Tech BIOMEDevice EDS
ATX East /MDM SEMICON West/Intersolar Nepcon South China
Autotestcon PCB West
The Battery Show SMTAI IMAPS
October
SMT & Production Productronica PP
Nov/Dec
Test & Measurement Electronics West/MDM PP
PP= Product Preview
The Assembly Show MDM Minneapolis Productronica
BIOMEDevice San Jose
TrADEShOW CAlENDAr SHOW
DATE
Jan. 29-31 Jan. 30-31 Feb. 5-7
March 19-21
April 24-26 May 7-9 May 8-9 May 15-16 May 15-18
June 11-13 July 9-11 Aug. 27-29
Sept. 10-12 Sept. 10-12 Sept. 10-12 Sept. 24-25 Oct. 1-3
Oct. 22-24 Oct. 23-24 Nov. 12-15 Dec. 4-5
LOCATION
San Diego, CA Santa Clara, CA Anaheim, CA
Anaheim, CA
Shanghai, China Nuremberg, Germany Milwaukee, WI Boston, MA Las Vegas, NV
New York, NY San Francisco, CA Shenzhen, China
National Harbor, MD Santa Clara, CA Novi, MI
Rosemont, IL Boston, MA
Rosemont, IL Minneapolis, MN Munich, Germany San Jose, CA
ATX/Electronics West/MDM Feb. 4-6/ 2020 Anaheim, CA
Sensors Industry Group (MSIG), Electronic System Design Alliance, as well as global partner associa- tions, such as IEEE and SAE International, which leads technical learning for the mobility industry. As a result, more than 2,100
global market-related businesses have teamed with SEMI to help structure content for the Technology Leadership Series of the Americas. Aligned from coast to coast, across a period of 12 months, the series is designed to foster the most critical discussions for con- necting both the short-term and long- term influence that impact the $2 tril- lion worth of emerging markets. The series further aims to remove guess- work about which of the world’s rapid- ly rising number of conferences pro- vides the highest ROI for the senior executive, engineer, scientist, and sales manager. The series of special conferences
began with the Industry Strategy Symposium in early January, which kicked off the new year with analysis of new and emerging demand drivers
for new architectures, new logic and memory, new streams of investment and how to advance arrivals and ensure longevities. The Flexible & Printed Electronics (FLEX) and MEMS & Sensors Technical Con - gress (MSTC), to be held Feb ruary 18 to 21, comprises two colocated events, designed to provide the most comprehensive technical conference as FLEX focuses on the design and manufacture of flexible electronics. This includes sensors, IC integration and substrates. MSTC focuses on the technology behind the trends in MEMS and sensors for autonomous mobility.
From May 6 to 9, the Advanced
Semiconductor Manufacturing Con - fer ence (ASMC), will provide ad - vanced manufacturing strategies and methodologies through a combined sharing of highlights and insights from device makers, equipment and materials suppliers and academics. Women in Semicon ductors will hold their third annual workshop.
Continued on next page
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
February 5-7, 2019, MD&M West. * Anaheim Convention Center, Anaheim, CA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.mdmwest.mddionline.com
March 4-7, 2019, IMAPS Device Packaging. * We-Ko-Pa Resort, Fountain Hills, AZ. Contact: IMAPS, P.O. Box 110127 Research Triangle Park, NC 27709 % 919-293-5000 Web:
www.imaps.org/devicepackaging
March 13-14, 2019, Texas Design-2-Part Show. * Gaylord Texan Convention Center, Grapevine, TX. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web:
www.d2p.com
March 17-21, 2019, APEC. * Anaheim Convention Center, Anaheim, CA. Contact: APEC
2018 c/o Smithbucklin, 2025 M Street N.W., Suite 800, Washington, D.C., 20036 % 202-973-8664 E-mail:
apec@apec-conf.org Web:
www.apec-conf.org
April 24-26, 2019, NEPCON China. * Shanghai World Expo Exhibition & Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F
Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail:
tim.wang@
reedexpo.com.cn Web:
www.nepconchina.com
May 7-9, 2019, SMTConnect. * NürnbergMesse, Nuremberg, Germany.
Contact: Mesago Messe Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 E-mail:
info@mesago.com Web:
www.smt.mesago.com
May 7-10, 2019, EDS.*The Mirage Las Vegas, Las Vegas, NV. Contact: EDS — Where the
Electronics Industry Connects, 310 Maxwell Road, Suite 200, Alpharetta, GA 30009 % 312-648-1140 E-mail:
eds@edsconnects.com Web:
www.edsconnects.com
May 8-9, 2019, EWPTE. * Wisconsin Center, Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 E-mail:
cheryl@epishows.com Web:
www.electricalwireshow.com
May 15-16, 2019, Design & Manufacturing New England. * Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
https://dm-newengland.com
May 15-16, 2019, BIOMEDevice.*Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
www.biomedevice.mddionline.com
May 22-23, 2019, Northern California Design-2-Part Show.*Santa Clara Convention
Center, Santa Clara, CA. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web:
www.d2p.com
June 11-13, 2019, MD&M East. * Jacob K. Javits Convention Center, New York, NY. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web:
https://advancedmanufacturingnewyork.com
February, 2019
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