February, 2019
www.us-tech.com
German RepRap 3D Printer Enables Liquid Additive Manufacturing (LAM)
Feldkirchen, Germany — German RepRap has been working for several years on the development of liquid additive manufacturing (LAM). LAM
ready LAM 3D printer, L280. LAM works with liquid materi-
al that is vulcanized under heat ex- posure to its final form, as opposed to FFF technology, which is based on melting a material and solidifying it again. Individual layers deposited by the printer bond together, rather than simply being welded. Objects can be produced that
have the same properties as injec- tion-molded parts. This is a clear ad- vantage, because insights from the 3D-printed prototype can be trans-
ferred directly to injection-molded se- rial parts. With LAM technology, the ap-
plication direction and the vulcaniza- tion at the macromolecular level can be influenced. The material partly of- fers better strength when compared with injection molding. It also offers all of the benefits of additive manu- facturing, such as freedom in design and filling in the interior of a struc- ture with patterns. The L280 has an area of 11 x 11 x 7.9 in. (28 x 28 x 20 cm), providing
layer thicknesses from 0.008 to 0.04 in. (0.2 to 0.9 mm). A heated print bed increases the adhesion of the printed parts and ensures optimal cross-linking. A high-temperature halogen lamp is used selectively in the process to accelerate the cross- linking.
Contact: German RepRap GmbH, Kapellenstrasse 7, 85622
Feldkirchen, Germany % +49-89-2488986-0 E-mail:
info@germanreprap.com Web:
www.germanreprap.com
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allows 3D printing of liquid or high- viscosity materials, such as liquid sil- icone rubber (LSR). The company has now introduced its production-
Circuitronics Adds Valor Software Module
Irving, TX — Circuitronics has added the Valor® process preparation mod- ule. The company is now offering evaluations of customer designs prior to prototyping as an optional service for production and prototype cus- tomers. The new service increases manufacturability at production launch.
The Valor process preparation
module is a complete engineering so- lution for DFX, process development and test engineering for PCB assem- bly operations. It improves the effi- ciency and quality of PCB assembly with tools that include optimized front-end DFA analysis, BOM valida- tion, stencil design, SMT program- ming, and line balancing. Process preparation, formerly
known as vPlan, delivers a complete software solution comprising DFX, SMT, assembly, and test engineering for PCB assembly operations. With a single central database of engineer- ing data based on import of ODB++, native CAD and BOM files with fully configurable manufacturing process definitions, the software is designed to ensure automated, error-free set ups and outputs for PCB assembly, test and inspection. Circuitronics is certified to ISO 9001:2008, IPC J- STD-001 and IPC A-610, as well as
ITAR-registered. Contact: Circuitronics, Inc.,
1920 Hurd Drive, Irving, TX 75038 % 214-460-0817
E-mail:
harsha@circuitronics.com Web:
www.circuitronics.com
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