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www.us-tech.com
February, 2019
Finetech Highlights Contactless Residual Solder Removal System
Gilbert, AZ — Finetech is highlight- ing its new SMART DESOLDER 01 at IPC APEX 2019. Using innovative technology developed by its sub- sidiary, Martin, the SMART DESOL- DER 01 combines a manual hot-gas source with a vacuum pen for non- contact extraction of residual solder.
solder is removed — without contact — using a vacuum pen. The Teflon tip in the vacuum pen eliminates sticking, is temperature-resistant, and offers a soft surface material with a long shelf life. As a compact, standalone de- vice, it fits on nearly any workbench
SMART DESOLDER 01 contactless solder removal system.
This process-controlled method has advantages over the hand wick (braid) technique by effortlessly re- moving components, without apply- ing and reapplying heat and pres- sure to the PCB over and over. Damage to the pads from over-
See at IPC APEX, Booth 617
heating or mechanical stress is avoided through targeted convection heating of the residual solder after component removal. The tempera- ture-controlled airflow prevents the neighboring components from heat- ing up. After melting, the residual
and can be easily operated for practi- cally any surface mount device. Mar- tin also provides bottom heaters HOTBEAM 04 or 05 to complement the SMART DESOLDER 01. These HOTBEAMS optimize the tempera- ture curve using a sensor-based or
programmed preheating profile. Contact: Finetech USA, 560 E.
Germann Road, Suite 103, Gilbert, AZ 85297 % 480-893-1630 Web:
www.finetechusa.com
See at IPC APEX, Booth 2427 INDEPENDENT CAPABILITY ANALYSIS EXPERTS
Random Defects Plaguing Your Quality Metrics?
If you don’t measure, you don’t know!
Print Accuracy & Squeegee Force Cp/Cpk
Chip & Glass Component Placement Accuracy
Placement Z-Force Measurements
MEASURE ACCURACY, VALIDATE PERFORMANCE Visit us at
IPC APEX Booth #2514
www.cetaq.com See at IPC APEX, Booth 2514
MSA Expanded Measurement Uncertainty < 1 µm Mobile On-site Service Over 22 Years Experience Independent 3rd Party Objective Analysis ISO 17025 Accredited
384 Route 101, Bedford, NH 03110 +1.603.883.7843
msivigny@cetaq-americas.com A division of CeTaQ GmbH
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